Method and system for calibrating imaging system

ABSTRACT

A method comprises capturing outputs of a VLC and an infrared array sensor (IAS). A memory includes a calibration based on a position of a laser pointer relative to the IAS. The method includes the laser pointer outputting a light beam to produce a laser dot on a target. The output of the VLC includes a representation of the laser dot. The output of the IAS includes values indicative of infrared radiation from the target. The method includes determining a temperature based on a portion of the values indicative of infrared radiation from the target. The portion of the values includes values associated with a portion of the target at which the laser dot is produced. The method includes displaying, on the display, the output of the VLC and the temperature. Displaying the output of the VLC includes displaying a visible light image showing the laser dot and at least a portion of the target.

BACKGROUND

To assist repair personnel, technicians, or other individuals, somemanufacturers build and sell imaging systems having an infrared arraysensor (IAS) and a visible light camera (VLC) capable of generating athermal image, a visible light image, and a blended image based on thethermal and visible light images. Those or other manufacturers may builddevices having visible light camera, an infrared spot sensor, and alaser pointer for displaying a laser dot on a target. Thosemanufacturers can manually align the laser pointer with the infraredspot sensor so that the infrared spot sensor can be used to calculate asurface temperature of the target. The temperatures measured using theinfrared spot sensor can be displayed by the system to indicate asurface temperature of a specific section of the target.

Manual alignment of a laser pointer with an infrared spot sensor canmake use of some sort of angular rotation freedom to aim the laserpointer and some sort of locking mechanism or material, such as an epoxyglue, to reliably maintain the relative angle between the laser pointerand the infrared spot sensor. Current laser-based thermal temperaturesensors typically use a separate elongated aiming device and epoxy toposition a laser pointer in an attempt to aim laser light output fromthe laser pointer towards a center of a thermal target detected by aninfrared spot sensor mounted on a printed circuit board. Such devicesare precisely aligned, but only at a given distance from the target dueto parallax circumstances. The manual alignment of the laser pointerwith the infrared spot sensor is labor intensive in both time and cost,and may be prone to misalignment if the system is moved, dropped orotherwise mechanically shocked.

OVERVIEW

In a first implementation, a method is provided. The method comprisescapturing output of a VLC and output of an infrared array sensor using asystem including the VLC, the infrared array sensor, a laser pointer, amemory, and a display. The memory includes a calibration based on aposition of the laser pointer relative to the infrared array sensor. Themethod also includes outputting, by the laser pointer, a light beam toproduce a laser dot on a target. The output of the VLC includes arepresentation of the laser dot. The output of the infrared array sensorincludes values indicative of infrared radiation from the target.Additionally, the method includes determining a temperature based on aportion of the values indicative of infrared radiation from the target.The portion of the values includes values associated with a portion ofthe target at which the laser dot is produced. Finally, the methodincludes displaying, on the display, the output of the VLC and thetemperature. Displaying the output of the VLC includes displaying avisible light image showing the laser dot and at least a portion of thetarget.

In a second implementation, a computing system is provided. Thecomputing system comprises one or more processors configured to captureoutput of a VLC and output of an infrared array sensor using a systemincluding the VLC, the infrared array sensor, a laser pointer, a memory,and a display. The memory includes a calibration based on a position ofthe laser pointer relative to the infrared array sensor. The one or moreprocessors are also configured to output, by the laser pointer, a lightbeam to produce a laser dot on a target. The output of the VLC includesa representation of the laser dot. The output of the infrared arraysensor includes values indicative of infrared radiation from the target.Additionally, the one or more processors are configured to determine atemperature based on a portion of the values indicative of infraredradiation from the target. The portion of the values includes valuesassociated with a portion of the target at which the laser dot isproduced. Finally, the one or more processors are further configured todisplay, on the display, the output of the VLC and the temperature.Displaying the output of the VLC includes displaying a visible lightimage showing the laser dot and at least a portion of the target.

In a third implementation, a computer-readable medium is provided. Thecomputer readable medium stores thereon instructions executable by oneor more processors to cause a computing system to perform functions. Thefunctions include capturing output of a VLC and output of an infraredarray sensor using a system including the VLC, the infrared arraysensor, a laser pointer, a memory, and a display. The memory includes acalibration based on a position of the laser pointer relative to theinfrared array sensor. The functions also include outputting, by thelaser pointer, a light beam to produce a laser dot on a target. Theoutput of the VLC includes a representation of the laser dot. The outputof the infrared array sensor includes values indicative of infraredradiation from the target. Additionally, the functions includedetermining a temperature based on a portion of the values indicative ofinfrared radiation from the target. The portion of the values includesvalues associated with a portion of the target at which the laser dot isproduced. Finally, the functions also include displaying, on thedisplay, the output of the VLC and the temperature. Displaying theoutput of the VLC includes displaying a visible light image showing thelaser dot and at least a portion of the target.

Other implementations will become apparent to those of ordinary skill inthe art by reading the following detailed description, with referencewhere appropriate to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

Example implementations are described herein with reference to thedrawings.

FIG. 1, FIG. 2, and FIG. 3 show an imaging system in accordance withexample implementations described herein.

FIG. 4 shows blended images in accordance with example implementationdescribed herein.

FIG. 5 is a block diagram of a system in accordance with exampleimplementations described herein.

FIG. 6 illustrates aspects output by an imaging system requiringalignment in accordance with example implementations described herein.

FIG. 7 is a block diagram of a computing system in accordance withexample implementations described herein.

FIG. 8 is an elevation view of aspects of the computing system shown inFIG. 7 in accordance with example implementations described herein.

FIG. 9 is a plan view of aspects of the computing system shown in FIG. 7in accordance with example implementations described herein.

FIG. 10, FIG. 11, FIG. 12, FIG. 13, FIG. 14, FIG. 15, FIG. 16, FIG. 17,FIG. 18, FIG. 19, FIG. 20, FIG. 21, FIG. 22, FIG. 23, FIG. 24, FIG. 25,FIG. 26, FIG. 27, FIG. 28, FIG. 29, FIG. 30, FIG. 31, FIG. 32, FIG. 33,FIG. 34, FIG. 35, FIG. 36, FIG. 37, FIG. 38, FIG. 39, FIG. 40, FIG. 41,FIG. 42, FIG. 43, FIG. 44, FIG. 45, FIG. 46, FIG. 47, FIG. 48, FIG. 49,FIG. 50, FIG. 51, FIG. 52, FIG. 53, FIG. 54, FIG. 55, FIG. 56, FIG. 57,FIG. 58 show component aligners in accordance with exampleimplementations described herein.

FIG. 59 depicts a flow chart showing an example method in accordancewith the example implementations described herein.

FIG. 60 shows an alignment fixture for calibrating a computing system inaccordance with the example implementations described herein.

FIG. 61 and FIG. 62 show screenshots captured during alignment of thecomputing system in accordance with the example implementationsdescribed herein.

FIG. 63 shows a screen shot of an imaging system display during a lasermode in accordance with the example implementations described herein.

FIG. 64 shows pixel maps in accordance with the example implementationsdescribed herein.

FIG. 65 shows screen shots of an imaging system display during alignmentin accordance with the example implementations described herein.

FIG. 66 shows a pixel map with respect to alignment of a laser dot andan alignment marker in accordance with the example implementationsdescribed herein.

FIG. 67 depicts a flow chart showing an example method in accordancewith the example implementations described herein.

DETAILED DESCRIPTION I. INTRODUCTION

This description describes several example implementations that pertainto apparatus and systems that include components that are to be aligned.For at least some of the example implementations, the apparatus andsystems pertain to an imaging system, such as an imaging system havingan infrared array sensor, a visible light camera, and a laser pointer.In some instances, the imaging system is referred to as a thermalimaging system as the infrared array sensor can function as a thermalcamera. An apparatus or system with dual cameras, such as a thermalcamera and a visible light camera, are subject to parallax problems andmisalignment of images captured by the dual cameras.

FIG. 6 illustrates outputs of components of the aforementioned apparatusand systems that require alignment. In particular, FIG. 6 showsrepresentations of a visible light image 92 output by a visible lightcamera, a thermal image 94 output by an infrared array sensor, and alaser dot 96 generated by the laser pointer and captured as part of thevisible light image 92 output by the visible light camera. The laser dot96 represents an incidental location of a laser output by the laserpointer relative to the visible light image 92 and the thermal image 94.As shown in FIG. 6, none of the visible light image 92, the thermalimage 94, and the laser dot 96 are centered or aligned, which canrepresent a typical misalignment that may be seen as a function ofnormal, random variation within a manufacturing environment.

The visible light and thermal images can be aligned with reasonableaccuracy. For example, in at least some implementations, a graphicalslide control, generated on a display, is operable to slide the visiblelight image in alignment with the thermal image so that linesrepresenting an outline of a target are not offset from an outline ofthe target in a thermal image. Sliding the visible light image caninclude mathematically positioning visible light image in alignment withthe thermal image. Once the visible light and thermal images arealigned, any position in the thermal image can be mapped to the visiblelight image. Depending on a size of the infrared array sensor and thevisible light camera, one of more outputs of the infrared array sensorand the visible light camera can be scaled prior to alignment of thevisible light and thermal images.

Moreover, with the visible light camera and the infrared array sensorlocated a known distance away from a target surface, the laser dot 96shown in the visible light image 92 can be identified and correlated toa position on the visible light image 92, and, therefore the thermalimage as well. The target surface can be a surface of a blackbody. Oncea position (e.g., a pinpoint) on the thermal image has been identified,the position can be saved and used to develop a tight, target area thatcorrelates to the incidental position of the laser pointer. The targetarea can then be used in conjunction with the laser pointer in order tooperate as a laser thermometer. Thus, the alignment can be done withoutaiming or calibrating the laser pointer mechanically. The storedrelative positions of the visible light image where the laser dot 96 isshown and of the thermal image can be saved. Storing the relativepositions can occur during a factory calibration of the thermal imagingsystem to perform alignment in software rather than in hardware.

A component aligner can be used to provide a known angular relationshipbetween the laser pointer and the infrared array sensor, and thecomponent aligner can be affixed to a substrate along with the visiblelight camera with a known angular relationship. Additionally, thecomponent aligner provides for calibrating the laser pointer and theinfrared array sensor so that that an output of the laser pointer isassociated with a specific, position within a matrix of the infraredarray sensor. That position can be defined as an area of the matrix tobe used for pinpoint temperature measurements that are associated with aposition of the output of the laser within the matrix of the infraredarray sensor. This position can vary randomly from unit to unit for eachthermal imaging system manufactured and can be stored as a calibrationvalue in a memory.

In some implementations, the component aligner includes a base and a topopposite the base. The component aligner also includes a body having oneor more exterior wall surfaces extending from the base to the top, afirst bore configured for fixed placement of a first component, and asecond bore configured for fixed placement of a second component. Thefirst bore extends between and through both the top and the base. Thefirst bore is defined at least in part by a first interior wall surfaceof the body. The second bore extends between and through both the topand the base. The second bore is defined at least in part by a secondinterior wall surface of the body. The component aligner also includes afirst slot within the body. The first slot is open at the first interiorwall surface and at the top.

In other implementations, the component aligner includes a base having afirst side of the base and a second side of the base opposite the firstside of the base. The apparatus also includes a first wall including afirst end of the first wall and a second end of the first wall. Thefirst wall extends from the second side of the base. The first end ofthe first wall is adjacent the second side of the base and opposite thesecond end of the first wall. The first wall includes a first interiorwall surface defining a first bore configured for fixed placement of afirst component. The apparatus also includes a second wall including afirst end of the second wall and a second end of the second wall. Thesecond wall extends from the second side of the base. The first end ofthe second wall is adjacent the second side of the base and opposite thesecond end of the second wall. The second wall includes a secondinterior wall surface defining a second bore configured for fixedplacement of a second component.

In accordance with at least some of the example implementations, thefirst and second components include an infrared array sensor and a laserpointer. Those components are used in conjunction with a visible lightcamera (VLC). Installation of the first and second components within thefirst and second bores aligns the first and second components with eachother.

An apparatus including a VLC, an infrared array sensor, a laser pointer,and a display can be configured to display a blended picture-in-picturebased on outputs of the VLC and the infrared array sensor. Thisapparatus can also display an output of the VLC with a laser dotcentered on the display and pointing to a portion of a target shown onthe display. Moreover, the apparatus can also display a temperatureindicative of a surface temperature of the portion of a target pointedto by the laser. For this apparatus or a similarly-equipped apparatus,it is desirable to align an output of the VLC with the output of theinfrared array sensor, and to align the laser pointer with the infraredarray sensor. An output of the visible light camera can be shifted sothat the pointer is shown in the center of the display.

In an example implementation, the infrared array sensor can, but neednot necessarily, be a 32×32 infrared array sensor having a 33°field-of-view, and the visible light camera can, but need notnecessarily, be a 640×480 VLC having a 59.9° horizontal field-of-viewand a 46.7° vertical field-of-view. In accordance with at least some ofthese implementations, a display of the apparatus can include a 240×240pixels liquid crystal display (LCD) arranged in a portrait mode, the VLCand the infrared array sensor are vertically aligned with the VLCrotated by 90°, and the output of the infrared array sensor is upscaledby a factor of 5 to 160×160 and shown in the center of the 240×240pixels LCD. A person skilled in the art will understand that otherexamples and arrangements of the infrared array sensor, VLC, and/or thedisplay for use in the other example implementations are also possible.

The example implementations provide for aligning a laser pointer with athermal image by using a visible light image as a reference to thethermal image. Such implementations remove the requirement for aimingthe output of the laser pointer to a specific point of the infraredarray sensor. Accordingly, problems associated with random variation inthe relative rotational positions of the infrared array sensor, thelaser pointer, and the visible light camera are mitigated.

II. EXAMPLE APPARATUS AND SYSTEMS

FIG. 1 shows an imaging system 10 in accordance with at least some ofthe example implementations. The imaging system 10 includes userinterface components 12, a display 14, a housing 16, and a handle 18.The user interface components 12 include an on/off button, a no button,a yes button, a move left button, a move up button, a move right button,a move down button, and a menu button. The handle 18 can, but need notnecessarily, be a part of the housing 16.

FIG. 2 shows the imaging system 10 including the housing 16, the handle18, and a user interface component 20. The user interface component 20is a trigger button configured to trigger capture of an image or video.The user interface component 20 can be configured to trigger stoppingcapture of the video.

FIG. 3 also shows the imaging system 10, the housing 16, the handle 18,the user interface component 20, as well as a laser pointer window 22, athermal imager window 24, a visible light window 26, and a light 28. Theimaging system 10 can include a component aligner to align components.As an example, the component aligner can align a laser pointer and aninfrared array sensor to each other and with respect to the laserpointer window 22 and the thermal imager window 24, respectively.

An image captured by the imaging system 10 can include a visible lightimage or a thermal image. The imaging system 10 can generate a blendedimage based on the visible light and thermal images. Similarly, a videocaptured by the imaging system 10 can include a visible light video or athermal video. The imaging system 10 can generate a blended video basedon the visible light and thermal videos.

FIG. 4 shows blended image 40, 42, 44, 46, 48. The imaging system 10 cangenerate the blended images from a visible light image and a thermalimage. The blended image 40, 42, 44, 46, 48 can be displayed on thedisplay 14. One or more icons can overlay an image displayed on thedisplay. For example, an opacity setting icon 50, a zoom icon 52, alight status icon 54, a battery state-of-charge icon 56, and/or atemperature icon 58 can be overlaid upon the blended image 40, 42, 44,46, 48.

For the blended image 40, the opacity setting icon 50 indicates 0% torepresent the blended image 40 is based on 100% of a visible light imageand 0% of a related thermal image. For the blended image 42, an opacitysetting icon indicates 25% to represent the blended image 42 is based on75% of a visible light image and 25% of a related thermal image. For theblended image 44, an opacity setting icon indicates 50% to represent theblended image 44 is based on 50% of a visible light image and 50% of arelated thermal image. For the blended image 46, an opacity setting icon(not shown) could indicate 75% to represent the blended image 46 isbased on 25% of a visible light image and 75% of a related thermalimage. For the blended image 48, an opacity setting icon (not shown)could indicate 100% to represent the blended image 48 is based on 0% ofa visible light image and 100% of a related thermal image.Alternatively, for an opacity value other than 0%, the opacity value canrepresent a percentage of the intensity detected for each pixel of thethermal image with the intensity detected for each pixel of the visiblelight image at 100% or another fixed percentage.

The zoom icon 52 can be switched to match a zoom setting (such as 1×,2×, or 3×) of a visible light camera or a thermal image camera. Thelight status icon 54 can be switched to indicate whether the light 28 ison or off. The battery state-of-charge icon 56 can be switched toindicate an integer or decimal percentage closest to a percentage valueof state-of-charge of a battery of a power supply in the imaging system10 with respect to when that battery is fully charged. The temperatureicon 58 can indicate a temperature detected at a portion of an imagesubject shown at and/or within a target shown on a thermal or blendedimage.

The display 14 can display a target on an object shown in an image. Fora thermal or blended image, the target can indicate a particularlocation on the object shown in the image at which a temperature isindicated by a temperature icon, such as the temperature icon 58. Inaccordance with an example implementation, a target can include across-hair, such as a cross-hair 60 on the blended image 44. Inaccordance with another example implementation, a target can include adot generated by a laser pointer within the imaging system 10. An outputof the laser pointer can pass through the laser pointer window 22.

Next, FIG. 5 shows a system 70 including a remote computing system 80, acommunication network 85 and a computing system 90. The communicationnetwork 85 can include one or more network components and one or morecommunication networks. A network component, such as a switch orgateway, can operatively couple two or more communication networks ofthe communication network 85 together. Other examples of a networkcomponent within the communication network 85 include: an access point,an antenna, a base station, a hub, a modem, a network cable, a networkinterface card, a relay, a receiver, a router, a transceiver, and/or atransmitter.

The communication network 85 is configured to carry communications. Forexample, the communication network 85 can be configured to carrycommunications from the computing system 90 to the remote computingsystem 80 and/or vice versa. Carrying the communications over thecommunication network 85 can occur over a wire and/or by radio.

In some implementations, the communication network 85 or at least aportion of the communication network 85 includes a local area network(LAN) and/or a wide area network (WAN). In some of thoseimplementations, the LAN and/or WAN carries data using packet-switchedand/or circuit-switched technologies. The LAN and/or WAN can include anair interface or a wire to carry the data.

In some implementations, the communication network 85 or at least aportion of the communication network 85 is configured to carry outcommunications using a Transmission Control Protocol (TCP) and theInternet Protocol (IP). Accordingly, the communication network 85 or atleast a portion of the communication network 85 can be part of thecommunication network commonly referred to as the Internet and/orinclude a network component providing access to data stored on the WorldWide Web. As an example, the communication network 85 can provide thecomputing system 90 with a path to the remote computing system 80 inorder to retrieve data, such as a web page, from the remote computingsystem 80. As another example, the communication network 85 can providethe computing system 90 with a path to the remote computing system 80 inorder to store data at the remote computing system 80, such as an imagegenerated at the computing system 90.

In accordance with an example implementation, the computing system 90can include the imaging system 10. In accordance with that exampleimplementation and/or another implementation, the remote computingsystem 80 can include a server.

FIG. 7 is a block diagram of a computing system 100 including aprocessor 102, a memory 104, an infrared array sensor 106, a visiblelight camera 108, a user interface 110, a display 112, a laser pointer114, a communication network interface 116, a power supply 118, asubstrate 120, a component aligner 122, a housing 124, and/or a light126. The computing system 100 can also include a data bus 128 tooperatively couple the processor 102, the memory 104, the infrared arraysensor 106, the visible light camera 108, the user interface 110, thedisplay 112, the laser pointer 114, the communication network interface116, and/or the light 126 to each other. The computing system 100 canalso include an electrical circuit 130 to couple the power supply 118 tothe processor 102, the memory 104, the infrared array sensor 106, thevisible light camera 108, the user interface 110, the display 112, thelaser pointer 114, the communication network interface 116, and/or thelight 126. As discussed further below, the memory 104 can include anon-volatile memory.

In accordance with an example implementation, the imaging system 10 caninclude and/or be configured like the computing system 100. Inaccordance with another example implementation, the computing system 90can include and/or be configured like the computing system 100. Thecomponent aligner 122 can, but need not necessarily, be configured likea component aligner described in section III of this description.Section IV of this description describes other components that can beincluded within example implementations of the computing system 100.

In accordance with the example implementations, the component aligner122 is configured to hold two components in alignment at an earlyproduction level, such as a production level when a substrate (e.g., aprinted circuit board) is being populated with components. The componentaligner 122 holds the two components in place while the two componentsare soldered to the substrate. No further mechanical positioning of thetwo components is necessary. The processor 102 can be configured toperform a calibration process that allows for performing pinpointtemperature measurements based on where an output of the laser pointer114 contacts a surface of a target. The two components installed intothe component aligner 122 can include two angular position-sensitivecomponents, such as the infrared array sensor 106 and the laser pointer114. In at least some implementations, the component aligner 122 canhold those two components in a parallel alignment such that the outputof the laser pointer 114 is in a known position relative to the infraredarray sensor 106, such as within the field-of-view of the infrared arraysensor 106. In other words, the component aligner 122 prevents angularrotation of the components installed within the component aligner 122.

The component aligner 122 can include a bore and a slot open to the boresuch that a tab of a component can be installed into the slot as thecomponent is being installed into the bore. Rotation of the componentinstalled into the bore can be limited by an amount of angular rotationthe tab is permitted to move, if at all, within the slot. The slots of acomponent aligner can allow more tolerance in the size of components tobe installed into the component aligner since the slot permits the wallof a component aligner to expand.

Next, FIG. 8 shows an elevation view of aspects of the computing system100 in accordance with an example implementation. This elevation viewshows the substrate 120 and components of the computing system 100 onand/or in the substrate 120. In particular, elevation view of FIG. 8shows the processor 102, the infrared array sensor 106, the visiblelight camera 108, the laser pointer 114, and the component aligner 122.The substrate 120 is shown to include holes 150, 152, 154, 156. Theholes 150, 152 are shown as extending only partly into the substrate120, but could be through-holes. The holes 154, 156 are shown asthrough-holes that extend completely through the substrate 120. Theholes 154 can, but need not necessarily, include a number of holes equalto a number of electrical pins 158 extending from an enclosure of theinfrared array sensor 106. Likewise, the holes 156 can, but need notnecessarily, include a number of holes equal to a number of electricalpins 160 extending from an enclosure of the visible light camera 108.

In the example implementation shown in FIG. 8, the component aligner 122is shown with a slot 140, a slot 142, a protrusion 146, a protrusion148, a bore 162, and a bore 164. The infrared array sensor 106 isdisposed within the bore 162 such that a tab 144 of the infrared arraysensor 106 is disposed within the slot 140. The tab 144 being disposedwithin the slot 140 provides for the infrared array sensor 106 beinginstalled within the component aligner 122 with a given orientation andcan prevent the infrared array sensor 106 from rotating at all orrotating beyond a minimal amount based on any gap between the tab 144and walls that define the slot 140.

The laser pointer 114 is disposed within the bore 162. The laser pointer114 can, but need not necessarily, include a tab to disposed within theslot 142 such that the laser pointer 114 is positioned in a particularorientation and to prevent the laser pointer 114 from rotating at all orrotating beyond a minimal amount based on any gap between a tab on thelaser pointer 114 and walls that define the slot 142.

Next, FIG. 9 shows a plan view of aspects of the computing system 100 inaccordance with an example implementation. The plan view shows thesubstrate 120 and the following components disposed on the substrate120: the processor 102, the memory 104, the infrared array sensor 106,the visible light camera 108, the laser pointer 114, the communicationnetwork interface 116, the power supply 118, the component aligner 122,the light 126, a connector 170, and a connector 172. In accordance withthis implementation, the connector 170 could be used to operativelyconnect the user interface 110 to the substrate 120, and the connector172 could be used to operatively connect the display 112 to thesubstrate 120. FIG. 9 also shows a top view of the slot 140 with the tab144 disposed within the slot 140, as well as the slot 142, the bore 162,and the bore 164. The substrate 120 can include the data bus 128 and theelectrical circuit, both shown in FIG. 7.

III. EXAMPLE COMPONENT ALIGNERS

In accordance with a first example implementation, the component aligner122 includes a base having a first side of the base and a second side ofthe base opposite the first side of the base. The component aligner alsoincludes a first wall including a first end of the first wall and asecond end of the first wall. The first wall extends from the secondside of the base. The first end of the first wall is adjacent the secondside of the base and opposite the second end of the first wall. Thefirst wall includes a first interior wall surface defining a first boreconfigured for fixed placement of a first component. The componentaligner also includes a second wall including a first end of the secondwall and a second end of the second wall. The second wall extends fromthe second side of the base. The first end of the second wall isadjacent the second side of the base and opposite the second end of thesecond wall. The second wall includes a second interior wall surfacedefining a second bore configured for fixed placement of a secondcomponent.

In at least some of the first example implementations of the componentaligner 122, a portion of the first wall is a portion of the secondwall.

In at least some of the first example implementations of the componentaligner 122, a portion of the first wall surrounds an entire crosssection of the first bore, and a portion of the second wall surrounds anentire cross section of the second bore. In at least some ofaforementioned implementations, the first wall does not contact thesecond wall.

In at least some of the first example implementations of the componentaligner 122, at least a portion of the first wall is cylindrical,rectangular, elliptical, oval, or stadium-shaped, and/or at least aportion of the second wall is cylindrical, rectangular, elliptical,oval, or stadium-shaped.

In at least some of the first example implementations of the componentaligner 122, a first portion of the second side of the base provides afirst ledge within the first bore, and/or a second portion of the secondside of the base provides a second ledge within the second bore.

In at least some of the first example implementations of the componentaligner 122, the first side of the base is flat, the first ledge has atop surface of the first ledge, the second ledge has a top surface ofthe second ledge, and the top surface of the first ledge, rather thanthe top surface of the second ledge, is closer to the first side of thebase.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 further includes a firstcomponent including a first lens and a second component including asecond lens. The first component is fixedly disposed within the firstbore and the second component is fixedly disposed within the secondbore.

In at least some of the first example implementations of the componentaligner 122, the first bore includes a first portion of the first boreand a second portion of the first bore. The first portion of the firstbore extends from the second end of the first wall to the top surface ofthe first ledge. The second portion of the first bore extends from thefirst side of the base to the top surface of the first ledge. Across-section of the first portion of the first bore is larger than across-section of the second portion of the first bore. Additionally, thesecond bore includes a first portion of the second bore and a secondportion of the second bore. The first portion of the second bore extendsfrom the second end of the second wall to the top surface of the secondledge. The second portion of the second bore extends from the first sideof the base to the top surface of the second ledge. A cross-section ofthe first portion of the second bore is larger than a cross-section ofthe second portion of the second bore.

In at least some of the first example implementations of the componentaligner 122, at least a portion of the first bore is tapered and/or atleast a portion of the second bore is tapered. A bore in the componentaligner 122 tapered such that a cross-section of the bore is larger nearthe top of the bore than away from the top of the bore easesinstallation of a component into the bore. As the precision ofcomponents increases, an amount of taper needed to ease installation ofthose components decreases.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 also includes the first componentand the first component is fixedly placed within the first bore.Additionally, the component aligner 122 includes the second componentand the second component is fixedly placed within the second bore. In atleast some of the aforementioned implementations, a longitudinalcenterline of the first component is parallel to a longitudinalcenterline of the second component. In at least some otherimplementations, a longitudinal centerline of the first component and alongitudinal centerline of the second component intersect at a givendistance away from an end of the first component and/or from an end ofthe second component.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 also includes a first slot withinthe first wall. The first slot is open at the first interior wallsurface and at the second end of the first wall. In at least some of theaforementioned implementations, the component aligner 122 also includesthe first component. The first component is fixedly placed within thefirst bore and the first component includes a tab disposed within thefirst slot.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 also includes a first slot withinthe first wall. The first slot is open at the first interior wallsurface and at the second end of the first wall. In at least some of theaforementioned implementations, the first wall includes a first exteriorwall surface of the first wall, and the first slot is further open atthe first exterior wall surface of the first wall.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 also includes a first slot withinthe first wall. The first slot is open at the first interior wallsurface and at the second end of the first wall. In at least some of theaforementioned implementations, the component aligner 122 also includesa second slot within the second wall. The second slot is open at thesecond interior wall surface and at the second end of the second wall.In at least some of the aforementioned implementations, the componentaligner 122 also includes the second component. The second component isfixedly placed within the second bore. The second component includes atab disposed within the second slot.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 also includes a first slot withinthe first wall. The first slot is open at the first interior wallsurface and at the second end of the first wall. In at least some of theaforementioned implementations, the second wall includes a firstexterior wall surface of the second wall, and the second slot is furtheropen at the first exterior wall surface of the second wall.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 is part of an apparatus. Thecomponent aligner 122 also includes a first slot within the first wall.The first slot is open at the first interior wall surface and at thesecond end of the first wall. In at least some of the aforementionedimplementations, the apparatus includes a least a first side of theapparatus and a second side of the apparatus that is distinct from thefirst side of the apparatus. The first slot is disposed on the firstside of the apparatus and the second slot is disposed on the second sideof the apparatus.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 also includes a substrate, andone or more protrusions extending from a surface of the first side ofthe base into a respective hole within the substrate.

In at least some of the first example implementations of the componentaligner 122, the component aligner 122 also includes a substrate. Thecomponent aligner 122 is disposed on the substrate. The componentaligner 122 also includes the first component, the second component, anda display configured to display a first image captured by a visiblelight camera, a second image captured by use of the second component, ora blended image based on the first image and the second image. The firstcomponent is fixedly placed within the first bore. The second componentis fixedly placed within the second bore. In at least some of theaforementioned implementations, the first component includes a laserpointer and the second component includes an infrared array sensor.Additionally, the infrared array sensor has a field of view and thefirst bore and the second bore can be configured so that an output ofthe laser pointer exists within the field of view.

In at least some of the first example implementations of the componentaligner 122, the first interior wall surface includes an upper end ofthe first interior wall surface, and the second interior wall surfaceincludes an upper end of the second interior wall surface. Additionally,a portion of the first wall is tapered from the second end of the firstwall to the upper end of the first interior wall surface or a portion ofthe second wall is tapered from the second end of the second wall to theupper end of the second interior wall surface.

FIG. 10, FIG. 11, FIG. 12, FIG. 13, and FIG. 14 show multiple views of acomponent aligner 200 in accordance with an example implementation. Inparticular, FIG. 10, FIG. 11 and FIG. 12 show perspective views, FIG. 13shows a bottom view, and FIG. 14 shows a top view. The component aligner200 includes a base 202, a first wall 204, and a second wall 206. Thefirst wall 204 includes a first end 208 and a second end 210. The secondwall 206 includes a first end 212 and a second end 214. The base 202includes a first side 216 and a second side 218. The first wall 204 andthe second wall 206 extend from the second side 218 of the base 202. Thefirst end 208 of the first wall 204 is adjacent to the second side 218of the base 202 and opposite the second end 210 of the first wall 204.The first end 212 of the second wall 206 is adjacent to the second side218 of the base 202 and opposite the second end 214 of the second wall206. The first side 216 of the base 202 includes a surface 258 of thebase 202. The second side 218 of the base 202 includes a surface 260 ofthe base 202. The first side 216 is opposite the second side 218. Inthis example implementation, the first wall 204 and the second wall 206do not directly contact one another or having any common portion that ispart of both the first wall 204 and the second wall 206.

A first bore 222 passes through the base 202 and is defined, in part, bythe first wall 204. The first wall 204 includes an interior wall surface220 and an exterior wall surface 224. The interior wall surface 220defines a first portion 240 of the first bore 222. The first bore 222 isconfigured for fixed placement of a first component. A second bore 228passes through the base 202 and is defined, in part, by the second wall206. The second wall 206 includes an interior wall surface 226 and anexterior wall surface 230. The interior wall surface 226 defines a firstportion 244 of the second bore 228. The second bore 228 is configuredfor fixed placement of a second component.

The first portion 240 of the first bore 222 can be referred to as anupper portion of the first bore 222. The first bore 222 also includes asecond portion 242 of the first bore 222. The first portion 240 of thefirst bore 222 extends from second end 210 of the first wall 204 to atop surface 234 of a ledge 232. The second portion 242 of the first bore222 extends from the first side 216 of the base 202 to the top surface234 of the ledge 232. A cross section of the first portion 240 of thefirst bore 222 is larger than a cross section of the second portion 242of the first bore 222. A size of the cross section of the first portion240 of the first bore 222 can permit a component to be disposed into thefirst bore 222, but the ledge 232 can prevent the component from passingentirely through the second portion 242 of the first bore 222. At leasta portion of electrical leads of a component disposed in the first bore222 can pass through the second portion 242 of the first bore 222 sothat those leads can contact the substrate 120.

The first portion 244 of the second bore 228 can be referred to as anupper portion of the second bore 228. The second bore 228 also includesa second portion 246 of the second bore 228. The first portion 244 ofthe second bore 228 extends from second end 214 of the second wall 206to a top surface 238 of a ledge 236. The second portion 246 of thesecond bore 228 extends from the first side 216 of the base 202 to thetop surface 238 of the ledge 236. A cross section of the first portion244 of the second bore 228 is larger than a cross section of the secondportion 246 of the second bore 228. A size of the cross section of thefirst portion 244 of the second bore 228 can permit a component to bedisposed into the second bore 228, but the ledge 236 can prevent thecomponent from passing entirely through the second portion 246 of thesecond bore 228. At least a portion of electrical leads of a componentdisposed in the second bore 228 can pass through the second portion 246of the second bore 228 so that those leads can contact the substrate120.

In some implementations, a distance from the top surface 234 of theledge 232 to the first side 216 of the base 202 is equal to a distancefrom the top surface 238 of the ledge 236 to the first side 216 of thebase 202. In other implementations, the distance from the top surface234 of the ledge 232 to the first side 216 of the base 202 is greaterthan or less than a distance from the top surface 238 of the ledge 236to the first side 216 of the base 202. In these latter implementations,the components to be installed into the first bore 222 and the secondbore 228 may have different heights, but have sub-components such as alens that are preferably disposed at a common distance above the firstside 216 of the base 202. Accordingly, a shorter component can beinstalled within the bore having a top surface of a ledge further awayfrom first side 216 of the base 202, and a longer component can beinstalled within the bore having a top surface of a ledge closer to thefirst side 216 of the base 202. In some implementations, a lens of acomponent can be within the bore of the component aligner 200 or outsideof the bore of the component aligner even though another portion of thecomponent with the lens is disposed within the bore.

The component aligner 200 includes a protrusion 252 and a protrusion254, both extending from the first side 216 of the base 202 and/or thesurface 258 of the base 202. The protrusions 252, 254 are configured forplacement within holes within a substrate, such as the holes 150, 152within the substrate 120. The protrusions 252, 254 can keep thecomponent aligner 200 from sliding across the substrate 120 once theprotrusions 252, 254 are disposed within the holes 150, 152. In someimplementations, the protrusions 252, 254 are arranged non-symmetricallyon the first side 216 and/or the surface 258 of the base 202 so that theprotrusions 252, 254 cannot be improperly installed into the holes 150,152 and to improve the likelihood that the component aligner 200 isproperly attached to the substrate 120. In some implementations, thecomponent aligner 200 includes a different quantity of protrusions onthe first side 216 and/or surface 258 of the base 202. In yet otherimplementations, no protrusions extend from the first side 216 and/orsurface 258.

In some implementations, the first side 216 of the base 202, other thanprotrusions 252, 254 extending from the first side 216 of the base 202is flat. In some implementations, a portion of the base 202 is taperedfrom the first side 216 of the base 202 to the ledge 232 and/or aportion of the base 202 is tapered from the first side 216 of the base202 to the ledge 236. Those tapered portions of the base can easeremoval of the component aligner 200 from a mold in which the componentaligner 200 is formed.

The base 202 includes a wall 256 extending from the first side 216 ofthe base 202 to the second side 218 of the base 202. The wall 256includes sides 262, 264, 266, 268.

A wall of a component aligner can include a slot. The slot provides alocation to place a tab of a component installed within a bore definedat least in part by the wall. The wall prevents or limits an amount ofrotation of the component installed within the bore. In some exampleimplementations, the slot within a wall can be open at an interior wallsurface of the wall including the slot. The slot can also be open at endof the wall, such as the top end of the wall including the slot. In atleast some of the implementations, the slot is also open at an exteriorwall surface of the wall including the slot.

The first wall 204 includes a slot 248. The slot 248 is open at theinterior wall surface 220, the second end 210 of the first wall 204, andat the exterior wall surface 224. Similarly, the second wall 206includes a slot 250. The slot 250 is open at the interior wall surface226, the second end 214 of the second wall 206, and at the exterior wallsurface 230. As shown in FIG. 10, the slot 248 and the slot 250 are on acommon side of the component aligner 200, namely, a side of thecomponent aligner 200 including the side 262. In other implementations,a slot in the first wall 204 and a slot in the second wall 206 are ondifferent sides of the component aligner 200.

A component aligner, such as the component aligner 200 or any othercomponent aligner described in this description, can, but need notnecessarily, be made from a high-temperature thermoplastic, such as apolyamide 46 (e.g., STANYL® Nylon 46 TE250F6). Other examples ofmaterial(s) used to make the component aligner 200 or any othercomponent aligner described in this description are also possible.

Next, FIG. 15, FIG. 16, FIG. 17, and FIG. 18 show multiple views of acomponent aligner 300 in accordance with an example implementation. Inparticular, FIG. 15, FIG. 16 and FIG. 17 show perspective views, andFIG. 18 shows a top view. The component aligner 300 is a variation ofthe component aligner 200. In this variation, the second wall 206includes a slot 302 instead of the slot 250. Unlike the slots 248 and250 that are on the same side of the component aligner 200, the slots248, 302 are on different sides of the component aligner 300. A bottomview of the component aligner 300 is identical to the bottom view of thecomponent aligner 200 shown in FIG. 13.

An advantage of having slots on different sides of the component aligner300 is that components having tabs can be disposed within the componentaligner 300 in an orientation in which the tabs are disposed ondifferent sides of the component aligner 300. An example orientation caninclude an orientation in which the tabs need to be located on differentsides of the component aligner 300 so that electrical voltage supplyleads of the components disposed within the first bore 222 and thesecond bore 228 are arranged to make contact with a common printedcircuit on the substrate 120.

Next, FIG. 19 shows a component aligner 320 in accordance with anexample implementation. The component aligner 320 is another variationof the component aligner 200. In this variation, the first wall 204 andthe second wall 206 do not include any slots, such as the slots 248, 250shown in FIG. 10, FIG. 11, and FIG. 12. A bottom view of the componentaligner 320 is identical to the bottom view of the component aligner 200shown in FIG. 13. A top view of the component aligner 320 is identicalto the top view of the component aligner 200 shown in FIG. 14 exceptthat the component aligner 320 does not include the slots 248, 250.

For walls made of the same size (e.g., thickness) and the same material,the first wall 204 and the second wall 206 of the component aligner 320are stronger than the first wall 204 and the second wall 206 of anembodiment in which the first wall 204 and the second wall 206 includesa slot that extends at least partially extending therein. Since thefirst wall 204 and the second wall 206 of the component aligner 320 donot include any slots, components installed in the first bore 222 andthe second bore 228 are not subject to dust or other materials thatmight otherwise pass through a slot in the first wall 204 and the secondwall 206 and accumulate on electrical pins of the components installedin the first bore 222 and the second bore 228.

FIG. 20 shows a component aligner 340 in accordance with an exampleimplementation. The component aligner 340 is another variation of thecomponent aligner 200. In this variation, the first wall 204 includes aslot 342 instead of the slot 248 and the second wall 206 includes a slot344 instead of the slot 250. The slot 342 is open at the interior wallsurface 220 and at the second end 210 of the first wall 204. The slot342 does not extend all the way through the first wall 204. Similarly,the slot 344 is open at the interior wall surface 226 and the second end214 of the second wall 206. The slot 344 does not extend all the waythrough the second wall 206. In other words, the slot 342 and the slot344 extend only partially into the first wall 204 and the second wall206, respectively. A bottom view of the component aligner 340 isidentical to the bottom view of the component aligner 200 shown in FIG.13. A top view of the component aligner 340 is identical to the top viewof the component aligner 200 shown in FIG. 14 except that the componentaligner 340 includes the slots 342 and 344 and does not include theslots 248, 250.

Advantageously, the slot 342 is configured for receiving a tab of acomponent such that the component can be slid within the first bore 222.Positioning the component tab within the slot 342 can prevent or limitrotation of that component while installed in the first bore 222 andallows for expansion of the first wall 204 where the component contactsthe interior wall surface 220. For walls made of the same size (e.g.,thickness) and the same material, the first wall 204 of the componentaligner 340 can be sturdier as compared to the first wall 204 inimplementations in which a slot extends completely through the firstwall 204. Furthermore, since the slot 342 extends only partially throughthe first wall 204, a component installed in the first bore 222 of thecomponent aligner 340 is not subject to dust or other materials passingthrough a slot in the first wall 204.

Similarly, the slot 344 is configured for receiving a tab of a componentsuch that the component can be slid within the second bore 228.Positioning the component tab within the slot 344 can prevent or limitrotation of that component while installed in the second bore 228 andallows for expansion of the second wall 206 where the component contactsthe interior wall surface 226. For walls made of the same size (e.g.,thickness) and the same material, the second wall 206 of the componentaligner 340 can be sturdier as compared to the second wall 206 inimplementations in which a slot extends completely through the secondwall 206. Furthermore, since the slot 344 extends only partially throughthe second wall 206, a component installed in the second bore 228 of thecomponent aligner 340 is not subject to dust or other materials passingthrough a slot in the second wall 206.

In yet another example implementation, a variation of the componentaligner 200 could include the first wall 204 with a slot, such as thefirst wall 204 shown in FIG. 15, and the second wall without a slot,such as the second wall 206 shown in FIG. 19. In still yet anotherexample implementation, a variation of the component aligner 200 couldinclude the first wall 204 without a slot, such as the first wall 204shown in FIG. 19, and the second wall with a slot, such as the secondwall 206 shown in FIG. 15.

Next, FIG. 21, FIG. 22, FIG. 23, and FIG. 24 show multiple views of acomponent aligner 360 in accordance with an example implementation. Inparticular, FIG. 21 shows a perspective view, FIG. 22 shows a bottomview, FIG. 23 shows a top view, and FIG. 24 shows an elevation view. Thecomponent aligner 360 is another variation of the component aligner 200.In this variation, the component aligner 360 includes the first wall 362and the second wall 206 instead of the first wall 204 and the secondwall 206. The first wall 362 is rectangular and is made up of multipleswalls including wall 364, 366, 368, 370. The first wall 362 and eachwall 364, 366, 368, 370 include a first end adjacent the second side 218of the base 202. FIG. 21 shows the first end 372 of the wall 366 and thefirst end 374 of the wall 368. FIG. 24 shows the first end 395 of thewall 364 and the first end 397 of the wall 370. The wall 364, 366, 368,370 include a second end 376, 378, 380, 382, respectively. The secondend 376, 378, 380, 382 make up a second end 384 of the first wall 362.

The first wall 362 as well as the wall 364, 366, 368, 370 that make upthe first wall, as well as the second wall 206, extend from the secondside 218 of the base 202. In this example implementation, the first wall362 and the second wall 206 do not directly contact one another orhaving any common portion that is part of both the first wall 362 andthe second wall 206.

A first bore 386 passes through the base 202 and is defined, in part, bythe first wall 362. The first wall 362 includes an interior wall surface388 and an exterior wall surface 390. The interior wall surface 388defines a first portion 392 of the first bore 386. The first bore 386 isconfigured for fixed placement of a first component. The exterior wallsurface 390 includes an exterior wall surface 393 (shown in FIG. 24)that is part of the wall 364.

The first portion 392 of the first bore 386 can be referred to as anupper portion of the first bore 386. The first bore 386 also includes asecond portion 394 of the first bore 386. The first portion 392 of thefirst bore 386 extends from second end 384 of the first wall 362 to atop surface 396 of a ledge 232. The second portion 394 of the first bore386 extends from the first side 216 of the base 202 to the top surface396 of the ledge 398. A cross section of the first portion 392 of thefirst bore 386 is larger than a cross section of the second portion 394of the first bore 386. A size of the cross section of the first portion392 of the first bore 386 can permit a component to be disposed into thefirst bore 386, but the ledge 398 can prevent the component from passingentirely through the second portion 394 of the first bore 386. At leasta portion of electrical leads of a component disposed in the first bore386 can pass through the second portion 394 of the first bore 386 sothat those leads can contact the substrate 120.

In some implementations, a distance from the top surface 396 of theledge 398 to the first side 216 of the base 202 is equal to a distancefrom the top surface 238 of the ledge 236 to the first side 216 of thebase 202. In other implementations, the distance from the top surface396 of the ledge 398 to the first side 216 of the base 202 is greaterthan or less than a distance from the top surface 238 of the ledge 236to the first side 216 of the base 202. In these latter implementations,the components to be installed into the first bore 386 and the secondbore 228 may have different heights, but have sub-components such as alens that are preferably disposed at a common distance above the firstside 216 of the base 202. Accordingly, a shorter component can beinstalled within the bore having a top surface of a ledge further awayfrom first side 216 of the base 202, and a longer component can beinstalled within the bore having a top surface of a ledge closer to thefirst side 216 of the base 202.

The first wall 362, in particular the wall 368, includes a slot 399. Theslot 399 is open at the interior wall surface 388 of the wall 368, thesecond end 380 of the first wall 362, and at the exterior wall surface390. As shown in FIG. 21, the slot 399 and the slot 250 are on a commonside of the component aligner 360, namely, a side of the componentaligner 200 including the side 262. In other implementations, a slot inthe first wall 362 and a slot in the second wall 206 are on differentsides of the component aligner 360.

Next, FIG. 25, FIG. 26, FIG. 27, and FIG. 28 show multiple views of acomponent aligner 351 in accordance with an example implementation. Inparticular, FIG. 25 shows a perspective view, FIG. 26 shows a bottomview, FIG. 27 shows an elevation view, and FIG. 28 shows a top view. Thecomponent aligner 351 is a variation of the component aligner 360. Inthis variation, the component aligner 351 includes the first wall 362and a second wall 353 instead of the first wall 362 and the second wall206. The first wall 362 is rectangular. Similarly, the second wall 353is also rectangular.

The first wall 362 is described above. The second wall 353 isrectangular and is made up of multiples walls including wall 355, 357,359, 361. The second wall 353 and each wall 355, 357, 359, 361 include afirst end adjacent the second side 218 of the base 202. FIG. 25 showsthe first end 363 of the wall 355 and the first end 365 of the wall 359.FIG. 27 shows the first end 363 of the wall 357, the first end 347 ofthe wall 355, and the first end 349 of the wall 361. The wall 355, 357,359, 361 include a second end 367, 369, 371, 373, respectively. Thesecond end 367, 369, 371, 373 make up a second end 375 of the secondwall 353.

The second wall 353, as well as the wall 355, 357, 359, 361 that make upthe second wall 353, and the first wall 362, extend from the second side218 of the base 202. In this example implementation, the first wall 362and the second wall 353 do not directly contact one another or havingany common portion that is part of both the first wall 362 and thesecond wall 353.

A second bore 377 passes through the base 202 and is defined, in part,by the second wall 353. The second wall 353 includes an interior wallsurface 379 and an exterior wall surface 381. The interior wall surface379 defines a first portion 383 of the second bore 377. The second bore377 is configured for fixed placement of a second component. Theexterior wall surface 381 includes an exterior wall surface 345 (shownin FIG. 27) that is part of the wall 355.

The first portion 383 of the second bore 377 can be referred to as anupper portion of the second bore 377. The second bore 377 also includesa second portion 385 of the second bore 377. The first portion 383 ofthe second bore 377 extends from second end 375 of the second wall 353to a top surface 387 of a ledge 389. The second portion 385 of thesecond bore 377 extends from the first side 216 of the base 202 to thetop surface 387 of the ledge 389. A cross section of the first portion383 of the second bore 377 is larger than a cross section of the secondportion 385 of the second bore 377. A size of the cross section of thefirst portion 383 of the second bore 377 can permit a component to bedisposed into the second bore 377, but the ledge 389 can prevent thecomponent from passing entirely through the second portion 385 of thesecond bore 377. At least a portion of electrical leads of a componentdisposed in the second bore 377 can pass through the second portion 385of the second bore 377 so that those leads can contact the substrate120.

In some implementations, a distance from the top surface 396 of theledge 398 to the first side 216 of the base 202 is equal to a distancefrom the top surface 387 of the ledge 389 to the first side 216 of thebase 202. In other implementations, the distance from the top surface396 of the ledge 398 to the first side 216 of the base 202 is greaterthan or less than a distance from the top surface 387 of the ledge 389to the first side 216 of the base 202. In these latter implementations,the components to be installed into the first bore 386 and the secondbore 377 may have different heights, but have sub-components such as alens that are preferably disposed at a common distance above the firstside 216 of the base 202. Accordingly, a shorter component can beinstalled within the bore having a top surface of a ledge further awayfrom first side 216 of the base 202, and a longer component can beinstalled within the bore having a top surface of a ledge closer to thefirst side 216 of the base 202.

The second wall 353, in particular the wall 359, includes a slot 391.The slot 391 is open at the interior wall surface 379 of the wall 359,the second end 371 of the wall 359, and at the exterior wall surface 381of the wall 359. As shown in FIG. 25, the slot 399 and the slot 391 areon a common side of the component aligner 351, namely, a side of thecomponent aligner 351 including the side 262. In other implementations,a slot in the first wall 362 and a slot in the second wall 353 are ondifferent sides of the component aligner 351.

Next, FIG. 29, FIG. 30, FIG. 31, FIG. 32, FIG. 33, and FIG. 34 showmultiple views of a component aligner 400 in accordance with an exampleimplementation. In particular, FIG. 29 shows a top view, FIG. 30 andFIG. 31 are perspective views, FIG. 32 is a side view, FIG. 33 is abottom view, and FIG. 34 is a section view. The component aligner 400 isanother variation of the component aligner 200, but is described withreference numbers starting with four instead of two.

The component aligner 400 includes a base 402, a first wall 404, and asecond wall 406. The first wall 404 includes a first end 408 and asecond end 410. The second wall 406 includes a first end 412 and asecond end 414. The base 402 includes a first side 416 and a second side418. The first wall 404 and the second wall 406 extend from the secondside 418 of the base 402. The first end 408 of the first wall 404 isadjacent to the second side 418 of the base 402 and opposite the secondend 410 of the first wall 404. The first end 412 of the second wall 406is adjacent to the second side 418 of the base 402 and opposite thesecond end 414 of the second wall 406. The first side 416 of the base402 includes a surface 458 of the base 402. The second side 418 of thebase 402 includes a surface 460 of the base 402. The first side 416 isopposite the second side 418. In this example implementation, the firstwall 404 and the second wall 406 do directly contact one another and/orinclude a common portion 470 that is part of both the first wall 404 andthe second wall 406.

A first bore 422 passes through the base 402 and is defined, in part, bythe first wall 404. The first wall 404 includes an interior wall surface420 and an exterior wall surface 424. The interior wall surface 420defines a first portion 440 of the first bore 422. The first bore 422 isconfigured for fixed placement of a first component. A second bore 428passes through the base 402 and is defined, in part, by the second wall406. The second wall 406 includes an interior wall surface 426 and anexterior wall surface 430. The interior wall surface 426 defines a firstportion 444 of the second bore 428. The second bore 428 is configuredfor fixed placement of a second component.

The first portion 440 of the first bore 422 can be referred to as anupper portion of the first bore 422. The first bore 422 also includes asecond portion 442 of the first bore 422. The first portion 440 of thefirst bore 422 extends from second end 410 of the first wall 404 to atop surface 434 of a ledge 432. The second portion 442 of the first bore422 extends from the first side 416 of the base 402 to the top surface434 of the ledge 432. As shown in FIG. 32, a cross section of the firstportion 440 of the first bore 422 is larger than a cross section of thesecond portion 442 of the first bore 422. A size of the cross section ofthe first portion 440 of the first bore 422 can permit a component to bedisposed into the first bore 422, but the ledge 432 can prevent thecomponent from passing entirely through the second portion 442 of thefirst bore 422. At least a portion of electrical leads of a componentdisposed in the first bore 422 can pass through the second portion 442of the first bore 422 so that those leads can contact the substrate 120.

The first portion 444 of the second bore 428 can be referred to as anupper portion of the second bore 428. The second bore 428 also includesa second portion 446 of the second bore 428. The first portion 444 ofthe second bore 428 extends from second end 414 of the second wall 406to a top surface 438 of a ledge 436. The second portion 446 of thesecond bore 428 extends from the first side 416 of the base 402 to thetop surface 438 of the ledge 436. As shown in FIG. 32, a cross sectionof the first portion 444 of the second bore 428 is larger than a crosssection of the second portion 446 of the second bore 428. A size of thecross section of the first portion 444 of the second bore 428 can permita component to be disposed into the second bore 428, but the ledge 436can prevent the component from passing entirely through the secondportion 446 of the second bore 428. At least a portion of electricalleads of a component disposed in the second bore 428 can pass throughthe first portion 444 of the second bore 428 so that those leads cancontact the substrate 120.

In some implementations, a distance from the top surface 434 of theledge 432 to the first side 416 of the base 402 is equal to a distancefrom the top surface 438 of the ledge 436 to the first side 416 of thebase 402. In other implementations, the distance from the top surface434 of the ledge 432 to the first side 416 of the base 402 is greaterthan or less than a distance from the top surface 438 of the ledge 436to the first side 416 of the base 402. In these latter implementations,the components to be installed into the first bore 422 and the secondbore 428 may have different heights, but have sub-components such as alens that are preferably disposed at a common distance above the firstside 416 of the base 402. Accordingly, a shorter component can beinstalled within the bore having a top surface of a ledge further awayfrom first side 416 of the base 402, and a longer component can beinstalled within the bore having a top surface of a ledge closer to thefirst side 416 of the base 402.

The component aligner 400 includes a protrusion 452 and a protrusion454, both extending from the first side 416 of the base 402 and/or thesurface 458 of the base 402. The protrusions 452, 454 are configured forplacement within holes within a substrate, such as the holes 150, 152within the substrate 120. The protrusions 452, 454 can keep thecomponent aligner 400 from sliding across the substrate 120 once theprotrusions 452, 454 are disposed within the holes 150, 152. In someimplementations, the protrusions 452, 454 are arranged non-symmetricallyon the first side 416 and/or the surface 458 of the base 402 so that theprotrusions 452, 454 cannot be improperly installed into the holes 150,152 and to improve the likelihood that the component aligner 400 isproperly attached to the substrate 120. In some implementations, thecomponent aligner 400 includes a different quantity of protrusions onthe first side 416 and/or surface 458 of the base 402. In yet otherimplementations, no protrusions extend from the first side 416 and/orsurface 458.

In some implementations, the first side 416 of the base 402, other thanprotrusions 452, 454 extending from the first side 416 of the base 402is flat. In some implementations, a portion of the base 402 is taperedfrom the first side 416 of the base 402 to the ledge 432 and/or aportion of the base 402 is tapered from the first side 416 of the base402 to the ledge 436. Those tapered portions of the base can easeremoval of the component aligner 400 from a mold in which the componentaligner 400 is formed.

The base 402 includes a wall 456 extending from the first side 416 ofthe base 402 to the second side 418 of the base 402. The wall 456includes sides 462, 464, 466, 468.

The first wall 404 includes a slot 448. The slot 448 is open at theinterior wall surface 420, the second end 410 of the first wall 404, andat the exterior wall surface 424. Similarly, the second wall 406includes a slot 450. The slot 450 is open at the interior wall surface426, the second end 414 of the second wall 406, and at the exterior wallsurface 430. As shown in FIG. 29, the slot 448 and the slot 450 are on acommon side of the component aligner 400, namely, a side of thecomponent aligner 400 including the side 462. In other implementations,a slot in the first wall 404 and a slot in the second wall 406 are ondifferent sides of the component aligner 400 and/or extend only part wayinto the first wall 404 and the second wall 406.

An interior surface of a wall of a component aligner can be tapered. Asan example, the interior surface of the first wall 404 could taper fromthe second end 410 of the first wall 404 to the top surface 434 of theledge 432. As another example, and as shown in FIG. 29, FIG. 30, andFIG. 34, a tapered portion 472 of the first wall 404 can taper downwardfrom the second end 410 of the first wall 404. The tapered portion 472can ease installation of a component into the first bore 422.

Next, in accordance with a second example implementation, the componentaligner 122 includes a base, a top opposite the base, a body, and afirst slot within the body. The body includes one or more exterior wallsurfaces extending from the base to the top, a first bore configured forfixed placement of a first component, and a second bore configured forfixed placement of a second component. The first bore extends betweenand through both the top and the base. The first bore is defined atleast in part by a first interior wall surface of the body. The secondbore extends between and through both the top and the base. The secondbore is defined at least in part by a second interior wall surface ofthe body. The first slot is open at the first interior wall surface andat the top.

In at least some of the second example implementations of the componentaligner 122, the base includes a first side of the base and a secondside of the base opposite the first side of the base, and the secondside of the base, rather than the first side of the base, is closer tothe top.

In at least some the aforementioned implementations, the body includes afirst wall and a second wall. The first wall includes: a first exteriorwall surface of the one or more exterior wall surfaces, a first end ofthe first wall, and a second end of the first wall opposite the firstend of the first wall. The first wall extends from the second side ofthe base to the second end of the first wall. Moreover, the second wallincludes: a second exterior wall surface of the one or more exteriorwall surfaces, a first end of the second wall, and a second end of thesecond wall opposite the first end of the second wall. The second wallextends from the second side of the base to the second end of the secondwall. Furthermore, in at least some of these implementations, (1) aportion of the first wall is a portion of the second wall, or (2) aportion of the first wall surrounds an entire cross section of the firstbore, a portion of the second wall surrounds an entire cross section ofthe second bore, and the first wall does not contact the second wall, or(3) at least a portion of the first wall is cylindrical, rectangular,elliptical, oval, or stadium-shaped, and/or at least a portion of thesecond wall is cylindrical, rectangular, elliptical, oval, orstadium-shaped.

In at least some of the second example implementations of the componentaligner 122, the base includes one or more exterior wall surfacesextending from the first side of the base to the second side of thebase, and the one or more exterior wall surfaces extending from the baseto the top includes one or more exterior wall surfaces extending fromthe second side of the base to the top. Moreover, in at least some ofthose implementations, a first portion of the second side of the baseprovides a first ledge within the first bore, and/or a second portion ofthe second side of the base provides a second ledge within the secondbore. In at least some of these implementations, the first ledge, ratherthan the second ledge, is closer to the top.

In at least some of the second example implementations of the componentaligner 122, the first bore includes a first portion of the first boreand a second portion of the first bore, the second bore includes a firstportion of the second bore and a second portion of the second bore.Moreover, the first portion of the first bore extends from top to thesecond side of the base, and the second portion of the first boreextends from the first side of the base to the second side of the base.Additionally, the first portion of the second bore extends from top tothe second side of the base, and the second portion of the second boreextends from the first side of the base to the second side of the base.Furthermore, a cross-section of the first portion of the first bore islarger than a cross-section of the second portion of the first bore, anda cross-section of the first portion of the second bore is larger than across-section of the second portion of the second bore.

In at least some of the example second implementations of the componentaligner 122, a cross-section of at least a portion of the body isrectangular, elliptical, oval, or stadium-shaped.

In at least some of the example second implementations of the componentaligner 122, at least a portion of the first bore is tapered, and/or atleast a portion of the second bore is tapered.

In at least some of the second example implementations of the componentaligner 122, the component aligner includes a second slot within thebody. The second slot is open at the second interior wall surface and atthe top. In at least some of the aforementioned implementations, thesecond slot is further open at an exterior wall surface of the one ormore exterior wall surfaces. Additionally or alternatively, in at leastsome of those aforementioned implementations, the body includes a leasta first side in the body and a second side in the body that is differentthan the first side of the body, and the first slot is in the first sideof the body and the second slot is in the second side of the body.

In at least some of the example second implementations of the componentaligner 122, the first slot is further open at an exterior wall surfaceof the one or more exterior wall surfaces.

In at least some of the example second implementations of the componentaligner 122, the base includes a first side of the base and a secondside of the base opposite the first side of the base, and the secondside of the base, rather than the first side of the base, is closer tothe top. Moreover, an apparatus including this component aligner alsoincludes a substrate and one or more protrusions extending from asurface of the first side of the base into a respective hole within thesubstrate.

In at least some of the example second implementations of the componentaligner 122, the first interior wall surface includes an upper end ofthe first interior wall surface, the second interior wall surfaceincludes an upper end of the second interior wall surface, and at leasta portion of the body is tapered from the top to the upper end of thefirst interior wall surface or from the top to the upper end of thesecond interior wall surface.

Next, FIG. 35, FIG. 36, FIG. 37, FIG. 38, FIG. 39 and FIG. 40 showmultiple views of a component aligner 600 in accordance with the secondexample implementations of the component aligner 122. In particular,FIG. 35 shows a perspective view, FIG. 36 shows an elevation view, FIG.37 shows a bottom view, FIG. 38 shows a top view, and FIG. 39 and FIG.40 show elevation views.

As shown in one or more of the aforementioned multiple views, thecomponent aligner 600 includes a top 602, a base 604, a body 606, a slot608, and a slot 610. The top 602 is opposite the base 604. The body 606includes exterior wall surface 612, 614, 616, 618. The exterior wallsurface 612 extends vertically from the base 604 to the top 602 exceptat the slots 608, 610, and horizontally from the exterior wall surface616 to the exterior wall surface 614 except at the slots 608, 610. Theexterior wall surface 614 extends vertically from the base 604 to thetop 602, and horizontally from the exterior wall surface 612 to theexterior wall surface 618. The exterior wall surface 616 extendsvertically from the base 604 to the top 602, and horizontally from theexterior wall surface 612 to the exterior wall surface 618. The exteriorwall surface 618 extends vertically from the base 604 to the top 602,and horizontally from the exterior wall surface 614 to the exterior wallsurface 616.

The body 606 includes a bore 620 configured for fixed placement of afirst component. The bore 620 extends between and through the top 602and the base 604. The bore 620 is defined at least in part by aninterior wall surface 624 of the body 606. Similarly, the body 606 alsoincludes a bore 622 configured for fixed placement of a secondcomponent. The bore 622 extends between and through the top 602 and thebase 604. The bore 622 is defined at least in part by an interior wallsurface 626 of the body 606. Fixedly placing a first component withinthe bore 620 and a second component within the bore 622 provides foralignment of those components.

The bore 620 can be configured with a ledge 628. The ledge 628 includesa top surface 630. The bore 622 can be configured with a ledge 632. Theledge 632 includes a top surface 634. In some implementations, adistance from the top surface 630 of the ledge 628 to the base 604 isequal to a distance from the top surface 634 of the ledge 632 to thebase 604. In other implementations, the distance from the top surface630 of the ledge 628 to the base 604 is greater than or less than adistance from the top surface 634 of the ledge 632 to the base 604. Inthese latter implementations, the components to be installed into thebore 620 and the bore 622 may have different heights, but havesub-components such as a lens that are preferably disposed at a commondistance above the base 604. Accordingly, a shorter component can beinstalled within the bore having a top surface of a ledge further awayfrom the base 604, and a longer component can be installed within thebore having a top surface of a ledge closer to the base 604.

In the implementation shown in FIG. 35, the slot 608 is open at theinterior wall surface 624, at the top 602, and at the exterior wallsurface 612. The body 606 includes a slot wall 636, a slot floor 638,and another slot wall across the slot 608 opposite the slot wall 636.The slot 608 is defined at least in part by the slot wall 636, theopposing slot wall in the body 606, and the slot floor 638. Similarly,the slot 610 is open at the interior wall surface 626, at the top 602,and at the exterior wall surface 612. The body 606 includes a slot wall640, a slot floor 642, and another slot wall across the slot 610opposite the slot wall 640. The slot 610 is defined at least in part bythe slot wall 640, the opposing slot wall in the body 606, and the slotfloor 642. In another implementation, the slot 608 and/or the slot 610extend only partially through the body 606 such that the slot 608 and/orthe slot 610 is not open at the exterior wall surface 612.

The component aligner 600 includes a protrusion 644 and a protrusion646, both extending from the base 604. The protrusions 644, 646 areconfigured for placement within holes within a substrate, such as theholes 150, 152 within the substrate 120. The protrusions 644, 646 cankeep the component aligner 600 from sliding across the substrate 120once the protrusions 644, 646 are disposed within the holes 150, 152. Insome implementations, the protrusions 644, 646 are arrangednon-symmetrically on the base 604 so that the protrusions 644, 646cannot be improperly installed into the holes 150, 152 and to improvethe likelihood that the component aligner 600 is properly attached tothe substrate 120. In some implementations, the component aligner 600includes a different quantity of protrusions on the base 604. In yetother implementations, no protrusions extend from the base 604. In someimplementations, the base 604, other than protrusions 644, 646 extendingfrom the base 604 is flat.

Next, FIG. 41, FIG. 42, FIG. 43, FIG. 44, FIG. 45, and FIG. 46 showmultiple views of a component aligner 660 in accordance with an exampleimplementation. In particular, FIG. 41 shows a perspective view, FIG. 42shows an elevation view, FIG. 43 shows a bottom view, FIG. 44 shows atop view, and FIG. 45 and FIG. 46 show elevation views.

The component aligner 660 is a variation of the component aligner 600.In this variation, the body 606 includes different length slots. Asshown in FIG. 41, the body 606 includes a slot 648 that is shorter thanthe slot 610, a slot wall 650, another slot wall across the slot 648opposite the slot wall 650, and a slot floor 652. A distance of the slotfloor 652 from the base 604 is longer than a distance of the slot floor642 from the base 604. In an alternative implementation, the slot 610 isshorter than the slot 648. In yet an alternative implementation, theslot 648 and/or the slot 610 is open at the exterior wall surface 614,the exterior wall surface 616, or the exterior wall surface 618 insteadof being open at the exterior wall surface 612.

Next, FIG. 47, FIG. 48, FIG. 49, FIG. 50, FIG. 51, and FIG. 52 showmultiple views of a component aligner 800 in accordance with the secondexample implementations of the component aligner 122. In particular,FIG. 47 shows a perspective view, FIG. 48 shows an elevation view, FIG.49 shows a bottom view, FIG. 50 shows a top view, and FIG. 51 and FIG.52 show elevation views. The component aligner 800 is a variation of thecomponent aligner 600 and a variation of the component aligner 660, butis described with reference numbers starting with eight instead of six.

As shown in one or more of the aforementioned multiple views, thecomponent aligner 800 includes a top 802, a base 804, a body 806, a slot848, and a slot 810. The top 802 is opposite the base 804. The body 806includes exterior wall surface 812, 814, 816, 818 and has a stadiumshape. The exterior wall surface 812 extends vertically from the base804 to the top 802 except at the slots 848, 810, and horizontally fromthe exterior wall surface 816 to the exterior wall surface 814 except atthe slots 848, 810. The exterior wall surface 814 extends verticallyfrom the base 804 to the top 802, and horizontally from the exteriorwall surface 812 to the exterior wall surface 818. The exterior wallsurface 816 extends vertically from the base 804 to the top 802, andhorizontally from the exterior wall surface 812 to the exterior wallsurface 818. The exterior wall surface 818 extends vertically from thebase 804 to the top 802, and horizontally from the exterior wall surface814 to the exterior wall surface 816.

Unlike the component aligner 600, 660 as shown in the drawings, in thisvariation the exterior wall surface 814, 816 are round instead ofstraight. The material disposed with a mold for a component aligner witha rounded wall can flow more easily within the mold as compared to amold for a component aligner with straight walls. Additionally oralternatively, less material may need to be added to a mold to make acomponent aligner with a round wall as compared to a component alignerwith straight walls. Unlike the component aligner 600 shown in FIG. 35,but rather like the component aligner 660 shown in FIG. 41, the slots810, 848 have different lengths. In an alternative arrangement, theslots 810, 848 can have a common length.

The body 806 includes a bore 820 configured for fixed placement of afirst component. The bore 820 extends between and through the top 802and the base 804. The bore 820 is defined at least in part by aninterior wall surface 824 of the body 806. Similarly, the body 806 alsoincludes a bore 822 configured for fixed placement of a secondcomponent. The bore 822 extends between and through the top 802 and thebase 804. The bore 822 is defined at least in part by an interior wallsurface 826 of the body 806. Fixedly placing a first component withinthe bore 820 and a second component within the bore 822 provides foralignment of those components.

The bore 820 can be configured with a ledge 828. The ledge 828 includesa top surface 830. The bore 822 can be configured with a ledge 832. Theledge 832 includes a top surface 834. In some implementations, adistance from the top surface 830 of the ledge 828 to the base 804 isequal to a distance from the top surface 834 of the ledge 832 to thebase 804. In other implementations, the distance from the top surface830 of the ledge 828 to the base 804 is greater than or less than adistance from the top surface 834 of the ledge 832 to the base 804. Inthese latter implementations, the components to be installed into thebore 820 and the bore 822 may have different heights, but havesub-components such as a lens that are preferably disposed at a commondistance above the base 804. Accordingly, a shorter component can beinstalled within the bore having a top surface of a ledge further awayfrom the base 804, and a longer component can be installed within thebore having a top surface of a ledge closer to the base 804.

In the implementation shown in FIG. 47, the slot 848 is open at theinterior wall surface 824, at the top 802, and at the exterior wallsurface 812. The body 806 includes a slot wall 850, a slot floor 852,and another slot wall across the slot 848 opposite the slot wall 850.The slot 848 is defined at least in part by the slot wall 850, theopposing slot wall in the body 806, and the slot floor 852. Similarly,the slot 810 is open at the interior wall surface 826, at the top 802,and at the exterior wall surface 812. The body 806 includes a slot wall840, a slot floor 842, and another slot wall across the slot 810opposite the slot wall 840. The slot 810 is defined at least in part bythe slot wall 840, the opposing slot wall in the body 806, and the slotfloor 842. In another implementation, the slot 848 and/or the slot 810extend only partially through the body 806 such that the slot 848 and/orthe slot 810 is not open at the exterior wall surface 812.

The component aligner 800 includes a protrusion 844 and a protrusion846, both extending from the base 804. The protrusions 844, 846 areconfigured for placement within holes within a substrate, such as theholes 150, 152 within the substrate 120. The protrusions 844, 846 cankeep the component aligner 800 from sliding across the substrate 120once the protrusions 844, 846 are disposed within the holes 150, 152. Insome implementations, the protrusions 844, 846 are arrangednon-symmetrically on the base 804 so that the protrusions 844, 846cannot be improperly installed into the holes 150, 152 and to improvethe likelihood that the component aligner 800 is properly attached tothe substrate 120. In some implementations, the component aligner 800includes a different quantity of protrusions on the base 804. In yetother implementations, no protrusions extend from the base 804. In someimplementations, the base 804, other than protrusions 844, 846 extendingfrom the base 804 is flat.

Next, FIG. 53, FIG. 54, FIG. 55, FIG. 56, FIG. 57, and FIG. 58 showmultiple views of a component aligner 860 in accordance with the secondexample implementations of the component aligner 122. In particular,FIG. 53 shows a perspective view, FIG. 54 shows an elevation view, FIG.55 shows a bottom view, FIG. 56 shows a top view, and FIG. 57 and FIG.58 show elevation views. The component aligner 860 is a variation of thecomponent aligner 600.

As shown in one or more of the aforementioned multiple views, thecomponent aligner 860 includes a top 862, a base 864, a body 870, a slot872, and a slot 874. The base 864 includes a first end 868 and a secondend 866. The top 862 is opposite the first end 868 of the base 864. Thebody 870 includes exterior wall surface 876, 878, 880, 882. The exteriorwall surface 876 extends vertically from the base 864 to the top 862except at the slots 872, 874, and horizontally from the exterior wallsurface 880 to the exterior wall surface 878 except at the slots 872,874. The exterior wall surface 878 extends vertically from the base 864to the top 862, and horizontally from the exterior wall surface 876 tothe exterior wall surface 882. The exterior wall surface 880 extendsvertically from the base 864 to the top 862, and horizontally from theexterior wall surface 876 to the exterior wall surface 882. The exteriorwall surface 882 extends vertically from the base 864 to the top 862,and horizontally from the exterior wall surface 878 to the exterior wallsurface 880.

The body 870 includes a bore 884 configured for fixed placement of afirst component. The bore 884 extends between and through the top 862and the first end 868 of the base 864. The bore 884 is defined at leastin part by an interior wall surface 888 of the body 870. Similarly, thebody 870 also includes a bore 886 configured for fixed placement of asecond component. The bore 886 extends between and through the top 862and the base 864. The bore 886 is defined at least in part by aninterior wall surface 890 of the body 870. Fixedly placing a firstcomponent within the bore 884 and a second component within the bore 886provides for alignment of those components.

The bore 884 can be configured with a ledge 896. The ledge 896 includesa top surface 898. The bore 886 can be configured with a ledge 883. Theledge 883 includes a top surface 885. In some implementations, adistance from the top surface 898 of the ledge 896 to the first end 868of the base 864 is equal to a distance from the top surface 885 of theledge 883 to the first end 868 of the base 864. In otherimplementations, the distance from the top surface 898 of the ledge 896to the first end 868 of the base 864 is greater than or less than adistance from the top surface 885 of the ledge 883 to the first end 868of the base 864. In these latter implementations, the components to beinstalled into the bore 884 and the bore 886 may have different heights,but have sub-components such as a lens that are preferably disposed at acommon distance above the first end 868 of the base 864. Accordingly, ashorter component can be installed within the bore having a top surfaceof a ledge further away from the first end 868 of the base 864, and alonger component can be installed within the bore having a top surfaceof a ledge closer to the first end 868 of the base 864.

In the implementation shown in FIG. 53, the slot 872 is open at theinterior wall surface 888, at the top 862, and at the exterior wallsurface 876. The body 870 includes a slot wall 892, a slot floor 894,and another slot wall across the slot 872 opposite the slot wall 892.The slot 872 is defined at least in part by the slot wall 892, theopposing slot wall in the body 870, and the slot floor 894. Similarly,the slot 874 is open at the interior wall surface 890, at the top 862,and at the exterior wall surface 876. The body 870 includes a slot wall881, a slot floor 887, and another slot wall across the slot 874opposite the slot wall 881. The slot 874 is defined at least in part bythe slot wall 881, the opposing slot wall in the body 870, and the slotfloor 887. In another implementation, the slot 872 and/or the slot 874extend only partially through the body 870 such that the slot 872 and/orthe slot 874 is not open at the exterior wall surface 876.

The component aligner 860 includes a protrusion 889 and a protrusion891, both extending from the first end 868 of the base 864. Theprotrusions 889, 891 are configured for placement within holes within asubstrate, such as the holes 150, 152 within the substrate 120. Theprotrusions 889, 891 can keep the component aligner 860 from slidingacross the substrate 120 once the protrusions 889, 891 are disposedwithin the holes 150, 152. In some implementations, the protrusions 889,891 are arranged non-symmetrically on the first end 868 of the base 864so that the protrusions 889, 891 cannot be improperly installed into theholes 150, 152 and to improve the likelihood that the component aligner860 is properly attached to the substrate 120. In some implementations,the component aligner 860 includes a different quantity of protrusionson the base 864. In yet other implementations, no protrusions extendfrom the base 864. In some implementations, the base 864, other thanprotrusions 889, 891 extending from the base 864 is flat.

FIG. 10 to FIG. 18 and FIG. 20 to FIG. 58 show example implementationsof a component aligner having two slots, namely a first slot open to aninterior surface of a first bore and a second slot open to an interiorsurface of a second bore. In alternative implementations, those examplecomponent aligners include the first slot, but not the second slot orthe second slot, but not the first slot.

The slots shown in the aforementioned implementations can, but need notnecessarily, be defined by a slot walls and a slot floor within a bodyof the component aligner. Moreover, the aforementioned implementationsare described as having ledges within the bores. Each ledge has a topsurface that can contact a component installed with the bore in whichthat ledge is located. In some implementations, the top surface of theledge is even with the slot floor of the slot that is open to the boreincluding the ledge. Such implementations are particularly useful when atab of a component to be installed with a bore is even with a bottom ofa package of that component. In other implementations, the top surfaceof the ledge is below the slot floor of the slot that is open to thebore including the ledge. Such implementations are particularly usefulwhen a tab of a component to be installed with a bore extends below therest of a bottom of a package of that component. In someimplementations, the top surface of the ledge is above the slot floor ofthe slot that is open to the bore including the ledge. Suchimplementations are particularly useful when a tab of a component to beinstalled with a bore is offset upwards from a bottom of a package ofthat component.

IV. FURTHER EXAMPLE SYSTEM COMPONENTS

1. Processor

A processor, such as the processor 102 or any other processor discussedin this description, can include one or more processors. Any processordiscussed in this description can thus be referred to as “at least oneprocessor” or “one or more processors.” Furthermore, any processordiscussed in this description can include a general purpose processor(e.g., an INTEL® single core microprocessor or an INTEL® multicoremicroprocessor), and/or a special purpose processor (e.g., a digitalsignal processor, a graphics processor, an embedded processor, or anapplication specific integrated circuit (ASIC) processor). Furthermorestill, any processor discussed in this description can include and/or beoperatively connected to a memory controller that controls a flow ofdata going to and from a memory, such as the memory 104. In at leastsome implementations of the remote computing system 80, the INTEL®multicore microprocessor can include one or more INTEL® XEON® processorshaving between four and twenty-eight cores.

Any processor discussed in this description can be configured to executecomputer-readable program instructions (CRPI). Any CRPI discussed inthis description can, for example, include assembler instructions,machine instructions, machine dependent instructions, microcode,firmware instructions, state-setting data, and/or either source code orobject code written in one or any combination of two or more programminglanguages. As an example, a programming language can include an objectoriented programming language such as Java, Python, or C++, or aprocedural programming language, such as the “C” programming language.Any processor discussed in this description can be configured to executehard-coded functionality in addition to or as an alternative tosoftware-coded functionality (e.g., via CRPI). In at least someimplementations of the computing system 100, the processor 102 can beprogrammed to perform any function(s) described in this description asbeing performed by the imaging system 10 and/or the computing system 90.

An embedded processor refers to a processor with a dedicated function orfunctions within a larger electronic, mechanical, pneumatic, and/orhydraulic device, and is contrasted with a general purpose computer. Theembedded processor can include a central processing unit chip used in asystem that is not a general-purpose workstation, laptop, or desktopcomputer. In some implementations, the embedded processor can execute anoperating system, such as a real-time operating system (RTOS). As anexample, the RTOS can include the SMX® RTOS developed by Micro Digital,Inc., such that the embedded processor can, but need not necessarily,include (a) an advanced RISC (reduced instruction set computer) machine(ARM) processor (e.g., an AT91SAM4E ARM processor provided by the AtmelCorporation, San Jose, Calif.), or (b) a COLDFIRE® processor (e.g., a52259 processor) provided by NXP Semiconductors N.V., Eindhoven,Netherlands. A general purpose processor, a special purpose processor,and/or an embedded processor can perform analog signal processing and/ordigital signal processing.

2. Memory

A memory, such as the memory 104 or any other memory discussed in thisdescription, can include one or more memories. Any memory discussed inthis description can thus be referred to as “at least one memory” or“one or more memories.” A memory can include a non-transitory memory, atransitory memory, or both a non-transitory memory and a transitorymemory. A non-transitory memory, or a portion thereof, can be locatedwithin or as part of a processor (e.g., within a single integratedcircuit chip). A non-transitory memory, or a portion thereof, can beseparate and distinct from a processor.

A non-transitory memory can include a volatile or non-volatile storagecomponent, such as an optical, magnetic, organic or other memory or discstorage component. Additionally or alternatively, a non-transitorymemory can include or be configured as a random-access memory (RAM), aread-only memory (ROM), a programmable read-only memory (PROM), anerasable programmable read-only memory (EPROM), a flash memory, anelectrically erasable programmable read-only memory (EEPROM), or acompact disk read-only memory (CD-ROM). The RAM can include static RAMor dynamic RAM. A non-transitory memory can be configured as a removablestorage device, a non-removable storage device, or a combinationthereof. A removable storage and/or a non-removable storage device can,but need not necessarily, include a magnetic disk device such as aflexible disk drive or a hard-disk drive (HDD), an optical disk drivesuch as a compact disc (CD) drive and/or a digital versatile disk (DVD)drive, a solid state drive (SSD), or a tape drive.

A transitory memory can include, for example, CRPI provided over acommunication network, such as the communication network 85.

A “memory” can be referred to by other terms such as a“computer-readable memory,” a “computer-readable medium,” a“computer-readable storage medium,” a “data storage device,” a “memorydevice,” “computer-readable media,” a “computer-readable database,” “atleast one computer-readable medium,” or “one or more computer-readablemediums.” Any of those alternative terms can be preceded by the prefix“transitory” if the memory is transitory or “non-transitory” if thememory is non-transitory. For a memory including multiple memories, twoor more of the multiple memories can be the same type of memory ordifferent types of memories.

3. Infrared Array Sensor

An infrared array sensor, such as the infrared array sensor 106 or anyother infrared array sensor discussed in this description, can include athermal array sensor to capture infrared radiation and output a thermalimage. In accordance with at least some example implementations, theinfrared array sensor can include a thermal array sensor configured todetect intensities and wavelengths of infrared radiation (e.g., 750 nmto 1 millimeter (mm)). As an example, the infrared array sensor caninclude a bolometer array sensor (e.g., an uncooled microbolometer) oran infrared thermopile array sensor. The infrared array sensor 106 caninclude a lens. The infrared array sensor 106 can include or be part ofa thermal camera. An output of the infrared array sensor 106 can bestored in the memory 104 as an image file or a video file.

In accordance with at least some example implementations, the thermalarray sensor can include an enclosure with a tab, such as a TO5enclosure, a TO18 enclosure, a TO39 enclosure, a TO46 enclosure, oranother type of enclosure with a tab. The tab of the enclosure can bedisposed within a slot of the component aligner 122.

In at least some of those implementations, the thermal array sensor caninclude four electrical pins operatively connectable to the substrate120. Those four pins can, but need not necessarily, include a serialdata pin, a positive supply voltage pin, a negative supply voltage pin,and a clock pin. In other implementations, the thermal array sensor canhave a number of pins other than four pins.

The thermal array sensor can output radiometry to provide a thermalimage with a temperature measurement. The temperature measurement canindicate a temperature of a portion of a target at which dot generatedby laser pointer 114 is shown on a thermal image of the target.

4. Visible light Camera

A visible light camera, such as the visible light camera 108 or anyother visible light camera described in this description, can include animage array sensor and a lens. In accordance with at least some exampleimplementations, the image array sensor of the visible light camera canbe configured to detect intensities and wavelengths (e.g., 380nanometers (nm) to 750 nm) of visible light radiation that is visible toa human eye. The array sensor of the visible light camera can include acharge-coupled device (CCD) image array sensor, a complementary metaloxide semi-conductor (CMOS) imager array sensor, and/or one or moreother optical elements that is/are known in the art. An output of theimage array sensor of the visible light camera can be stored in thememory 104 as an image file or a video file.

In at least some of the example implementations, the visible lightcamera can include a filter and/or lens cover. In those and/or otherexample implementations, the visible light camera can an image sensordriver, a shutter, and/or output signal processing circuity. In at leastsome of the aforementioned limitations, the processor 102 can, but neednot necessarily, include the image sensor driver, the shutter, and/orthe output signal processing circuity

5. User Interface

A user interface, such as user interface 110 or any other user interfacedescribed in this description, can include one or more user interfacecomponents. A user interface component can be configured for use by auser to enter data and/or a selection to the computing system 100 and/orto present an output, such as a visual, audible, or haptic output.

In at least some implementations, the user interface 110 includes akeyboard having one or more components configured for entering dataand/or a selection into the computing system 100. The keyboard caninclude one or more keys. In at least some implementations, each keyincludes a push button, such as a press-and-hold button or apress-and-release button. In at least some implementations, at least aportion of the keyboard is implemented as part of a touch screen displaythat includes soft keys, such as capacitive or resistive keys of a touchscreen display. In still other implementations, the soft keys of thekeyboard on the touch screen display can include a power on/off key, ayes key and a no key, and/or four directional cursor keys (such as left,up, right, down keys). The keyboard can, but need not necessarily,include a QWERTY keyboard.

In accordance with an implementation in which the computing system 100is configured like the imaging system 10, the user interface componentsof the user interface 110 include the user interface components 12, 20.In accordance with at least some of the example implementations, thedisplay 112 includes a touch screen display configured for entering dataand/or user selections.

6. Display

A display, such as the display 112 or any other display described inthis description, can include one or more displays. As an example, adisplay can include a capacitive touch screen display, a resistive touchscreen display, a plasma display, a light emitting diode (LED) display,a cathode ray tube display, an organic light-emitting diode (OLED)display, or a liquid crystal display (LCD). An OLED display can includean active-matrix OLED or a passive-matrix OLED. The LCD can include abacklit, color LCD. The display 112 can include a touch screen displaywith the LCD. For instance, the display 112 can include a capacitive orresistive touch screen display. Other examples of the display 112 arealso possible.

The display 112 can display a still image, such as a visible lightimage, a thermal image, and/or a blended image. The display 112 can alsodisplay a video. The display 112 can display a text file, such as a textfile with a PDF file extension or an XML, file extension. The display112 can display a hypertext markup language file. The display 112 candisplay a web page. In at least some implementations, the display 112can display a graphical user interface (GUI). Other examples of contentdisplayable by the display 112 are also possible.

7. Laser Pointer

A laser pointer, such as a laser pointer 114 or any other laser pointerdescribed in this description, can include a laser diode (e.g., a FabryPerot (FP) laser diode) and a laser diode package. In at least someimplementations, the laser pointer includes a lens and a lens cap. Inthose or in other implementations, the laser diode package can include aTO can package. As an example, a TO can package could include a thin,flat base having a tab, and a hollow cylindrical cap affixed to thebase. The base can, but need not necessarily, be cylindrical except forthe tab extending from the base. A diameter of the base can be largerthan a diameter to the cylindrical can. The laser pointer can includemultiple electrical leads extending from within the cylindrical cap andthrough and beyond the base.

In accordance with the aforementioned implementations, the laser pointer114 can be disposed within a bore of a component aligner with itselectrical leads first. At least a portion of the electrical leads canpass through the base of the component aligner (e.g., the base 202 ofthe component aligner 200). A top surface of a ledge (e.g., the topsurface 234 of the ledge 232) within a bore (e.g., the first bore 222)can stop the laser pointer 114 from proceeding further into the borewhen a base of the laser diode package contacts the top surface of theledge. Other example implementations of the laser pointer 114 are alsopossible.

8. Communication Network Interface

A communication network interface, such as the communication networkinterface 116 or any other communication network interface described inthis description, can include one or more communication networkinterface configured for transmitting data to the communication network85 and/or receiving data from the communication network 85. Thecommunication network interface can include one or more transceivers.Each transceiver includes one or more transmitters configured totransmit data onto a network, such as the communication network 85, adata bus, and/or some other type of connection mechanism. Eachtransceiver includes one or more receivers configured to receive data ora communication carried over a network, such as the communicationnetwork 85, a data bus, and/or some other type of connection mechanism.Unless stated differently, any data described as being transmitted to adevice or system is considered to be received by that device or system.Similarly, unless stated differently, any data described as beingreceived from a device or system is considered to be transmitted by thatdevice or system directly or indirectly to the receiving device orsystem. For some implementations, a transceiver can include atransmitter and a receiver in a single semiconductor chip. In at leastsome of those implementations, the semiconductor chip can include aprocessor.

In at least some of the example implementations, a transmitter, such asa transmitter within any transceiver described in this description,transmits radio signals carrying data, and a receiver, such as areceiver within any transceiver described in this description, receivesradio signals carrying data. A transceiver with a radio transmitter andradio receiver can include one or more antennas and can be referred toas a “radio transceiver,” an “RF transceiver,” or a “wirelesstransceiver.” “RF” represents “radio frequency.”

A radio signal transmitted or received by a radio transceiver can bearranged in accordance with one or more wireless communication standardsor protocols such as an IEEE® standard, such as (i) an IEEE® 802.11standard for wireless local area networks (wireless LAN) (which issometimes referred to as a WI-FI® standard) (e.g., 802.11a, 802.11b,802.11g, 802.11n or 802.11ac), (ii) an IEEE® 802.15 standard (e.g.,802.15.1, 802.15,3, 802.15.4 (ZIGBEE®), or 802.15.5) for wirelesspersonal area networks (PANs), (iii) a BLUETOOTH® version 4.1 or 4.2standard developed by the Bluetooth Special Interest Group (SIG) ofKirkland, Wash., (iv) a cellular wireless communication standard such asa long term evolution (LTE) standard, (v) a code division multipleaccess (CDMA) standard, (vi) an integrated digital enhanced network(IDEN) standard, (vii) a global system for mobile communications (GSM)standard, (viii) a general packet radio service (GPRS) standard, (ix) auniversal mobile telecommunications system (UMTS) standard, (x) anenhanced data rates for GSM evolution (EDGE) standard, (xi) amultichannel multipoint distribution service (MMDS) standard, (xii) anInternational Telecommunication Union (ITU) standard, such as the ITU-TG.9959 standard referred to as the Z-Wave standard, (xiii) a 6LoWPANstandard, (xiv) a Thread networking protocol, (xv) an InternationalOrganization for Standardization (ISO/International ElectrotechnicalCommission (IEC) standard such as the ISO/IEC 18000-3 standard for NearField Communication (NFC), (xvi) the Sigfox communication standard,(xvii) the Neul communication standard, or (xviii) the LoRaWANcommunication standard. Other examples of the wireless communicationstandards or protocols are possible.

In at least some of the implementations, a transmitter, such as atransmitter within any transceiver described in this description, can beconfigured to transmit a signal (e.g., one or more signals or one ormore electrical waves) carrying or representing data onto an electricalcircuit (e.g., one or more electrical circuits). Similarly, a receiver,such as a receiver within any transceiver described in this description,can be configured to receive via an electrical circuit a signal carryingor representing data over the electrical circuit. The electrical circuitcan be part of a network, such as the communication network 85, or adata bus, such as the data bus 128. The signal carried over anelectrical circuit can be arranged in accordance with a wiredcommunication standard such as a Transmission Control Protocol/InternetProtocol (TCP/IP), an IEEE® 802.3 Ethernet communication standard for aLAN, a data over cable service interface specification (DOCSISstandard), such as DOCSIS 3.1, a universal serial bus (USB)specification, or some other wired communication standard. In accordancewith at least some implementations, an electrical circuit can include awire, a printed circuit on a substrate, and/or a network cable (e.g., asingle wire, a twisted pair of wires, a fiber optic cable, a coaxialcable, a wiring harness, a power line, a printed circuit, a CAT5 cable,and/or CAT6 cable). The wire can be referred to as a “conductor”. As anexample, transmission of data over the conductor can occur electricallyand/or optically.

A transceiver that is configured to carry out communications over thecommunication network 85 can include a modem, a network interface card,a local area network (LAN) on motherboard (LOM), and/or a chip mountableon a circuit board. As an example the chip can include a CC3100 Wi-Fi®network processor available from Texas Instruments, Dallas, Tex., aCC256MODx Bluetooth® Host Controller Interface (HCI) module availablefrom Texas instruments, or a different chip for communicating viaWi-Fi®, Bluetooth® or another communication protocol.

A network device within and/or coupled to the communication network 85and/or that communicates via the communication network 85 using apacket-switched technology can be locally configured for a next ‘hop’ inthe communication network 85 (e.g., a device or address where to senddata to, and where to expect data from). As an example, a device (e.g.,a transceiver) configured for communicating using an IEEE® 802.11standard can be configured with a network name, a network security type,and a password. Some devices auto-negotiate this information through adiscovery mechanism (e.g., a cellular phone technology).

The data transmitted by a communication network interface can include adestination identifier or address of a computing system to which thedata is to be transmitted. The data or communication transmitted by acommunication network interface can include a source identifier oraddress of the computing system including the communication networkinterface. The source identifier or address can be used to send aresponse to the computing system that includes the communication networkinterface that transmitted the data.

9. Light

A light, such as the light 126, can be configured to illuminate areas oflow light during use of the visible light camera 108. The light 126 canhave one or more different output levels, such as 7.0 lumens, 12.0lumens, and/or 22.0 lumens. In accordance with at least some exampleimplementations, the light 126 can include an LED.

10. Power Supply

A power supply, such as the power supply 118 or any other power supplydescribed in this description can be arranged in various configurations.As an example, the power supply 118 can include circuity to receive ACcurrent from an AC electrical supply (e.g., electrical circuitsoperatively connected to an electrical wall outlet) and a converter toconvert the AC current to a DC current for supplying to one or more ofthe components of the computing system 100. As another example, thepower supply 118 can include a battery or be battery operated. As yetanother example, the power supply 118 can include a solar cell or besolar operated. The power supply 118 can include and/or operativelyconnect to electrical circuits arranged to distribute electrical currentthroughout the power supply 118 and/or the computing system 100. Otherexamples of the power supply 118 are also possible.

11. Substrate

A substrate, such as the substrate 120 or any other substrate describedin this description, is a substrate configured for mounting andoperatively connecting two more components of the computing system 100.In accordance with at least some example implementations, the substratecomprises a fiberglass circuit board with copper foil bonded to thecircuit board. In accordance with at least some other exampleimplementations, the substrate comprises a ceramic printed circuitboard, such as a ceramic circuit board having a metal core. Thedescribed substrate can comprise a single-sided circuit board, adouble-sided circuit board, or a multi-layered circuit board.

12. Housing

A housing, such as the housing 124 or any other housing described inthis description, can be configured in any of a variety ofconfigurations. For example, the housing 124 can surround at least aportion of the following: the processor 102, the memory 104, theinfrared array sensor 106, the visible light camera 108, the userinterface 110, the display 112, the laser pointer 114, the communicationnetwork interface 116, the power supply 118, the substrate 120, thecomponent aligner 122, and/or the light 126. The housing 124 can supportthe substrate 120. In at least some example implementations, at least aportion of the following: the processor 102, the memory 104, theinfrared array sensor 106, the visible light camera 108, the userinterface 110, the display 112, the laser pointer 114, the communicationnetwork interface 116, the power supply 118, the substrate 120, thecomponent aligner 122, and/or the light 126 can be mounted on and/orconnect to the substrate 120. The housing 124 can be configured like thehousing 16. The housing 124 can be made from various materials. In someexample implementations, the housing 124 is made from a plastic material(e.g., acrylonitrile butadiene styrene (ABS)). In the exampleimplementations in which the housing 124 includes a handle, such as thehandle 18, a portion of the housing including the handle can be madefrom a thermoplastic elastomer to form a grip on the handle.

13. Memory Content

The memory 104 contains computer-readable data. As an example, thememory 104 contains computer-readable programming instructions (CRPI)executable by the processor 102. In accordance with this example, theCRPI can include program instructions executable by the processor 102 tocause the computing system 100 to perform the functions shown in FIG. 59and/or any function of an example implementation described in connectionwith the functions shown in FIG. 59. Similarly, the CRPI can includeprogram instructions executable by the processor 102 to cause thecomputing system 100 to perform the functions shown in FIG. 67 and/orany function of an example implementation described in connection withthe functions shown in FIG. 67.

In at least some of the example implementations, the memory 104 containsdata representing the output of the VLC 108, the output of the infraredarray sensor 106, a scaled VLC output generated by processor 102, ascaled thermal output generated by the processor 102, and/or coordinatesof one or more coordinates of the infrared array sensor to calibrate thecomputing system 100. In at least some of the example implementations,the memory 104 contains a temperature determined by the processor 102based on temperature values represented by one or more sensors of theinfrared array sensor 106. In at least some of the exampleimplementations, the memory 104 contains an image, such as a visiblelight image based on output of the visible light camera 108, a thermalimage based on output of the infrared array sensor 106, or a blendedimage based on the visible light image and the thermal image.

In at least some of the example implementations, the CRPI are executableby the processor 102 to provide one or more of the following operatingmodes: a visible light mode, an overlay mode, a full thermal mode, and alaser mode, and to provide for selection of one of the operating modes.In the visible light mode, the processor 102 causes the display 112 todisplay an output of the visible light camera 108. In the overlay mode,the processor 102 causes the display 112 to display an output based onan output of the visible light camera 108 with a transparent thermalimage overlay based on an output of the infrared array sensor 106. Inthe full thermal mode, the processor 102 causes the display 112 todisplay a full thermal image based on an output of the infrared arraysensor 106. In the laser mode, the processor 102 causes the laserpointer 114 to output a laser and the display 112 to display an outputof the visible light camera 108. The user interface 110 can be used toselect the operating mode.

In at least some of the example implementations, the CRPI are executableby the processor 102 to configure the computing system 100 for operatingat different distances from a target. The user interface 110 can be usedto select a distance from a target, such as a near operating distance ora far operating distance. In response to selecting the distance from thetarget, the processor 102 can cause the system to use a calibrationbased on a position of the laser pointer the infrared array sensor, asdescribed in this description.

The memory 104 can include a pixel map for the infrared array sensor106. In an example, implementation in which the infrared array sensor106 includes a 32×32 infrared array sensor, the pixel map for theinfrared array sensor 106 can include a map with 32 columns and 32 rows,where the pixels in a top row are associated with consecutive integers 0through 31 from left to right and each next row downwards, from left toright is numbered sequentially starting with the next integer followingthe integer associated with the right-most pixel in the preceding row.The right-most pixel of the bottom row is associated with the integer1,023.

The memory 104 can include a pixel map for the visible light camera 108.In an example, implementation in which the visible light camera 108includes a 640×480 image sensor, the pixel map for the visible lightcamera 108 can include a map with 640 columns and 480 rows, where thepixels in a top row are associated with consecutive integers 0 through639 from left to right and each next row downwards, from left to rightis numbered sequentially starting with the next integer following theinteger associated with the right-most pixel in the preceding row. Theright-most pixel of the bottom row is associated with the integer307,199.

The memory 104 can include a pixel map for the display 112. In anexample, implementation in which the display 112 is a 240×240 pixeldisplay, the pixel map for the display 112 can include a map with 240columns and 240 rows, where the pixels in a top row are associated withconsecutive integers 0 through 239 from left to right and each next rowdownwards, from left to right is numbered sequentially starting with thenext integer following the integer associated with the right-most pixelin the preceding row. The right-most pixel of the bottom row isassociated with the integer 57,599.

The memory 104 can store one or more scaling factors. At least some ofthe scaling factors can be associated with upscaling the output of theinfrared array sensor 106 for displaying on the display 112. Forexample, the output of a 32×32 infrared array sensor can be upscaled bya scaling factor of five to result in a 160×160 scaled output of theinfrared array sensor. At least some of the scaling factors can beassociated with distance between the computing system 100 and a target,such as the scaling factors applied to an output of the visible lightcamera 108 so that outputs of the visible light camera 108 and theinfrared array sensor 106 are aligned. The scaling factors for theinfrared array sensor 106 and/or the visible light camera 108 can be aninteger or fraction value

The memory 104 can store alignment values, such as any alignment valuedescribed in this description. The stored alignment values can indicatea number of pixels the output of the visible light camera 108 needs tobe shifted up or down and/or left or right to be in alignment with anoutput of the infrared array sensor 106 when both are displayed on thedisplay 112. Those alignment values can be stored as signed integers,such as int16 signed integers.

The memory 104 can also include, in non-volatile memory, alignmentvalues pertaining to the laser pointer 114. In at least someimplementations, the alignment vales pertaining to the laser pointer 114include coordinates regarding the laser pointer 114 with respect to theinfrared array sensor 106. Those alignment values can include a rowcoordinate and a column coordinate of a laser dot in the infrared arraysensor 106. Those alignment values can be stored as unsigned integers,such as uintl6 unsigned integers. The processor 102 can use thosealignment values for the laser pointer 114 to determine which specificpixels, e.g., four, nine or sixteen pixels surrounding, adjacent, and/orin proximity the alignment values, are designated for determining anaverage temperature of a target surface where the laser pointer 114 ispointing to produce the laser dot. The row and column coordinates of theinfrared array sensor 106 for use as alignment values for the laserpointer 114 can be determined as the corresponding row and columncoordinates of the output of the visible light camera 108 that overlayor are overlaid upon the row and column coordinates of the output of theinfrared array sensor 106.

The alignment values pertaining to the laser pointer 114 can alsoinclude values indicating a row coordinate and a column coordinate ofthe laser dot in an output of the VLC 108 and values indicating a widthof the laser dot in pixels and a height of the laser dot in pixels.These alignment values can be stored as unsigned integers, such asuintl6 unsigned integers. The memory 104 can include a checksum withrespect to one or more alignment values.

V. EXAMPLE OPERATION

Next, FIG. 59 shows a flowchart depicting a set of functions 590 (ormore simply “the set 590”) that can be carried out in accordance with atleast some of the example implementations described in this description.The set 590 includes the functions shown in block 591 through block 599.The following description of the set 590 includes references to elementsshown in other figures described in this description, but the functionsof the set 590 are not limited to being carried out only by thereferenced elements. A variety of methods can be performed using all ofthe functions shown in the set 590 or any proper subset of the functionsshown in the set 590. Any of those methods can be performed with otherfunctions such as one or more of the other functions described in thisdescription. At least a portion of two or more functions of the set 590can occur simultaneously.

Block 591 includes capturing output of the VLC 108 and output of theinfrared array sensor 106 using a system including the VLC 108, theinfrared array sensor 106, the laser pointer 114, the memory 104, andthe display 112. In at some implementations, the system includes theimaging system 10, the computing system 90, and/or the computing system100. Capturing the output of the VLC 108 can include detectingintensities and wavelengths of visible light radiation that is visibleto a human eye and storing representations of the detected intensitiesand wavelengths of visible light radiation within the memory 104.Capturing the output of the infrared array sensor 106 can includedetecting intensities and wavelengths of infrared radiation and storingrepresentations of the detected intensities and wavelengths of infraredradiation within the memory 104.

Next, block 592 includes scaling the output of the VLC 108 and theoutput of the infrared array sensor 106 to generate a scaled VLC outputand a scaled thermal output, respectively. Scaling an output can includeupscaling or downscaling the output. Scaling the output of the VLC 108and/or the output of the infrared array sensor 106 can result in scaledoutputs that have the same scale such that both scaled outputs includethe same or overlapping field-of-view and/or can be aligned.

In at least some implementations, the output of the infrared arraysensor 106 is upscaled by an integer scaling factor, such as 3, 4, 5, or6. Alternatively, the output of the infrared array sensor 106 isupscaled by a fractional scaling factor. In at least some of thoseimplementations, the processor 102 scales the output of the infraredarray sensor 106 using bilinear scaling.

In at least some implementations, the output of the visible light camera108 is scaled to the same scale as the scaled thermal output or isalready at the same scale as the scaled thermal output. To achieve thatcommon scaling, the output of the VLC 108 could be scaled using aninteger or fractional scale. In at least some implementations, theprocessor 102 down-scales the output of the VLC 108 using bilinearscaling and decimation.

Next, block 593 includes aligning the scaled VLC output to the scaledthermal output to generate an aligned image based on the scaled VLCoutput and the scaled thermal output. Aligning the scaled VLC output andthe scaled thermal output can result in scaled outputs that have thesame or overlapping field-of-view at a certain distance. In at leastsome implementations, the display 112 displays the scaled VLC output andthe scaled thermal output with a blending factor between twenty percentand one hundred percent, where the blending factor indicates an opacitylevel of the scaled thermal output, although the blending factor forother implementations could be any range between zero and one hundredpercent. The blending factor can be selected by a user of the deviceusing the user interface 110. In at least some of those implementations,the processor 102 can be configured to change the blending factor inlinear steps, such as linear steps of one percent, twenty percent, orsome other percentage.

In at least some implementations, aligning the scaled VLC output to thescaled thermal output occurs while the system is held by an alignmentfixture, such as the alignment fixture 900 shown in FIG. 60. In those orin other implementations, a target of the scaled VLC output and of thescaled thermal output is a blackbody and/or an infrared source of ablackbody calibrator.

In at least some example implementations, positions of the output of theinfrared array sensor and the scaled thermal output are fixed such thataligning the scaled VLC output includes repositioning the scaled VLCoutput with respect to the scaled thermal output. In thoseimplementations, fixing the scaled thermal output can occur because theoutput of the infrared array sensor 106 is smaller than an output of thevisible light camera 108 and none of the scaled thermal output needs tobe omitted when generating the aligned image. The output of the infraredarray sensor 106 is typically smaller than an output of the visiblelight camera 108 because infrared array sensors are typically moreexpensive than visible light cameras.

In alternative implementations, aligning the scaled VLC output includesrepositioning the scaled thermal output with respect to the scaled VLCoutput, or repositioning both the scaled VLC output and the scaledthermal output with respect to each other.

In at least some of the example implementations, aligning the scaled VLCoutput to the scaled thermal output can include use of a move leftbutton, a move up button, a move right button, and/or a move down buttonas shown in FIG. 1 to move the scaled VLC output in alignment with thescaled thermal output.

FIG. 61 shows a screenshot 936 of the display 112 and FIG. 62 shows ascreenshot 938 of the display 112, both captured during alignment of thecomputing system 100 in accordance with an example implementation. Inthis implementation, the computing system 100 is affixed to thealignment fixture 900 such that the infrared array sensor 106 and thevisible light camera 108 can capture images of the blackbody calibrator912. The screenshot 936 represents that the scaled VLC output is notaligned with the scaled thermal output. In this implementation, theprocessor 102 outputs an alignment marker 940, such as a line or across-hair, centered on the display 112. The alignment marker 940 iscentered for implementations in which the scaled output of the infraredarray sensor 106 is centered on the display 112. The line of thealignment marker 940 can match a shape of a target plate in theblackbody calibrator 912. As shown in FIGS. 61 and 62 the line of thealignment marker 940 is circular. Furthermore, the line of the alignmentmarker 940 can, but need not necessarily, be a dotted line, as shown inFIG. 61 and FIG. 62.

In an implementation in which a size and shape of an infrared source(such as a target plate) of a blackbody calibrator is known, thealignment marker 940 can be configured as a dotted line corresponding tothat known size and shape. In such implementations, the dotted line canbe shown on the display as the same size or slightly larger than theinfrared source within the blackbody calibrator for a particulardistance between the computing system 100 and the blackbody calibrator.

The screenshot 936 shows an infrared representation 942 of a targetplate of the blackbody calibrator 912, a temperature value 944calculated by the processor 102, a temperature scale 946, and a visiblelight camera representation 948 of the target plate of the blackbodycalibrator 912. The alignment marker 940, the temperature value 944, andthe temperature scale 946 can be overlaid upon the scaled VLC outputdisplayed on the display 112 or the scaled VLC output displayed on thedisplay 112 can be overlaid upon the alignment marker 940, thetemperature value 944, and the temperature scaled 946. The alignmentmarker 940, when arranged as a cross-hair, can appear like thecross-hair 60 shown in FIG. 4. The alignment marker 940, when arrangedas a dotted line, can be configured for a selected alignment distanceand for a known blackbody calibrator, as a size of the target plate ofthe blackbody calibrator 912 visible on the display 112 can bedetermined for different distances.

The screenshot 938 also shows the infrared representation 942 of thetarget plate of the blackbody calibrator 912, the temperature value 944calculated by the processor 102, the temperature scale 946, thealignment marker 940, and the visible light camera representation 948 ofthe target plate of the blackbody calibrator 912, except that unlike thescreenshot 936, the scaled VLC output displayed on the display 112 andthe scaled thermal output are in alignment. This could result from useof the user interface 110 to move the scaled VLC output so that thetarget plate is shown centered within the target plate window 916. Aquantity of pixels the scaled VLC output is moved in a horizontaldirection and a quantity of pixels the scaled VLC output is moved in avertical direction can be stored in the memory 104 as calibration and/oralignment values for the aligned computing system.

Next, block 594 includes determining one or more alignment values basedon the aligned image. The alignment value(s) can be stored innon-volatile memory. The alignment value(s) can be associated with adistance between the computing system 100 and a target. The alignmentvalues stored in the memory can include alignment values for a neardistance and other alignment values for a far distance.

In at least some implementations, an alignment value of the one or morealignment values can include an alignment value indicative of a quantityof pixels the scaled VLC output was shifted to align with the scaledthermal output. The alignment value can further indicate a shiftdirection, such as shift up, shift down, shift left or shift right. Analignment value can equal zero (0) if the output of the VLC does nothave be shifted up or down, or shifted left or right. As an example, thealignment value representing a number of pixels can be configured as anint16 value between −32768 and 32767. A negative value could indicateshift up or shift left. Other example data type(s) of the alignmentvalue representing a number of pixels are also possible.

In at least some of implementations, an alignment value of the one ormore alignment values can include a coordinate, such as a cornercoordinate, of the scaled VLC output where the scaled VLC output and thescaled thermal output are aligned. The coordinate can indicate a row andcolumn within a pixel map, such as a pixel map 730. A corner coordinateof the scaled VLC output, such as a top left corner coordinate of thescaled VLC output, can be in alignment with an upper left corner pixelof the scaled thermal output. With the number of rows and columns ofpixels of the scaled thermal output known and a coordinate of the scaledVLC output known, the processor 102 can programmatically determine whichrows and columns of the scaled VLC output should be used retained andwhich rows and columns of the scaled VLC output can be discarded whenoutputting a blended image with the scaled VLC output aligned with thescaled thermal output.

Turning to FIG. 64, a pixel map 730 and a pixel map 732 are shown. As anexample, the pixel map 730 is for the scaled VLC output and the pixelmap 732 is for the scaled thermal output. The pixel map 732 canrepresent pixels centered on the display 112, such that a common numberof pixels of the display 112 are above, below, and on both the left andright sides of the pixels that are represented by the pixel map 732.

The pixel map 730 includes X times Y pixels. The pixel map 730 includesX columns and Y rows, where the pixels in a top row of the pixel map 730are associated with consecutive integers 0 through (X-1) from left toright and each next row downwards, from left to right is numberedsequentially starting with the next integer following the integerassociated with the right-most pixel in the preceding row. Theright-most pixel of the bottom row is associated with the integer(X×Y-1). For an implementation in which the visible light camera 108includes a 640×480 image sensor, X equals 640 and Y equals 480. Examplesof integers or formulas to determine integers associate with four cornerpixels of the pixel map 730 are shown in FIG. 64 within square brackets.Those integers can represent pixel numbers and/or coordinates.

The pixel map 732 includes M times N pixels. The pixel map 732 includesM columns and N rows, where the pixels in a top row of the pixel map 732are associated with consecutive integers 0 through (M-1) from left toright and each next row downwards, from left to right is numberedsequentially starting with the next integer following the integerassociated with the right-most pixel in the preceding row. Theright-most pixel of the bottom row is associated with the integer(M×N-1). For an implementation in which the infrared array sensor 106includes a 32×32 infrared array sensor and the scaled thermal output isupscaled by 5, M equals 160 and Y equals 160. Examples of integers orformulas to determine integers associate with four corner pixels of thepixel map 732 are shown in FIG. 64 within squiggly brackets. Thoseintegers can represent pixel numbers and/or coordinates.

In at least some implementations, determining the one or morecoordinates of the scaled thermal output in relation to one or morecoordinates of the scaled VLC output can include determining thecoordinates of pixels 734, 736, 738, and/or 740 of the pixel map 730that correspond to the corner pixels of the pixel map 732. In at leastsome implementations, the coordinates are defined by row and columnnumbers of the pixel map 730. In alternative implementations, thecoordinates are defined by a pixel number of the pixel map 730.

Returning to FIG. 59, block 595 includes outputting, by the laser diode,a light beam to produce a laser dot on a target and then capturing afurther output of the VLC. The further output of the VLC includes arepresentation of the laser dot. The further output of the VLC canfurther include a representation of at least a portion of the target. Inat least some implementations, outputting the light beam can occur inresponse to the processor 102 determining the laser mode of the system100 has been selected by the user interface 110.

Next, block 596 includes displaying, on the display, the further outputof the VLC, and an alignment marker. In at least some implementations,an identifier corresponding to a field-of-view of the infrared arraysensor 106 is also displayed on the display.

Turning to FIG. 65, a screen shot 700 in accordance with an exampleimplementation is shown. The screen shot 700 could be captured while thedisplay 112 is displaying the further output of the VLC. The screen shot700 includes a menu 706, a menu 708, a representation 710 of the furtheroutput of the VLC, an identifier 712 corresponding to the field-of-viewof the infrared array sensor 106, an alignment marker 714, and arepresentation of the laser dot 716. The alignment marker 714 can, butneed not necessarily, be a cross-hair.

Returning to FIG. 59, block 597 includes shifting the alignment markeror the representation of the laser dot so that the alignment marker andthe representation of the laser dot are shown at a common position onthe display. As an example, showing the alignment marker and therepresentation of the laser dot at the same position can includedisplaying the alignment marked overlaid upon the representation of thelaser dot or vice versa. In an implementation in which the alignmentmarker is larger than the representation of the laser dot, showing thealignment marker and the representation of the laser dot at the sameposition can include displaying the alignment marker except where therepresentation of the laser dot is displayed within a portion of thealignment marker. In an implementation in which the representation ofthe laser dot is larger than the alignment marker, showing the alignmentmarker and the representation of the laser dot at the same position caninclude displaying the representation of the laser dot except where thealignment marker is displayed within a portion of the representation ofthe laser dot.

Returning to FIG. 65, a screen shot 702 in accordance with an exampleimplementation is shown. The screen shot 702 is a variation of thescreen shot 700. In this variation, the alignment marker 714 has beenshifted so that the alignment marker 714 and the representation of thelaser dot 716 are shown at a common position on the display 112.

A screen shot 704 is also shown in FIG. 65. The screen shot 704 isanother variation of the screen shot 700. In this variation, therepresentation of the laser dot 716 has been shifted so that thealignment marker 714 and the representation of the laser dot 716 areshown at a common position on the display 112.

Next, FIG. 66 shows an example of the alignment marker 714 and therepresentation of the laser dot 716 with respect to a center portion ofthe pixel map 730. The pixel map 730 includes multiple columns includingcolumns 731, 733, 735, multiple rows including rows 737, 739, 741, andpixels 742, 743, 744, 745, 746, 747, 748, 749. In FIG. 66, a center ofthe laser dot 716 is located in pixels 742, 743, 744, 745 and/or acorner where pixels 742, 743, 744, 745 meet. In FIG. 66, a center of thealignment marker 714 is located in pixels 746, 747, 748, 749 and/or acorner where pixels 746, 747, 748, 749 meet.

Shifting the alignment marker 714 to be in a common position with therepresentation of the laser dot 716 includes shifting the alignmentmarker 714 horizontally to the left by six pixels and vertically upwardsby six pixels. On the other hand, shifting the representation of thelaser dot 716 to be in a common position with the alignment marker 714includes shifting the representation of the laser dot 716 horizontallyto the right by six pixels and vertically downwards by six pixels.

Returning to FIG. 59 once again, block 598 includes determining one ormore values associated with the output of the infrared array sensorbased on one or more values associated with the further output of theVLC where the alignment marker and the representation of the laser dotare shown at the common position on the display.

Next, block 599 includes storing in the memory the one or morecoordinates of the output of the infrared array sensor to calibrate thesystem based on a position of the laser diode relative to the infraredarray sensor. That position may be incidental based on the laser diodeand the infrared array sensor being disposed within a component aligner,such as any component aligner described in this description. In order tobe able to determine a temperature of a target at a location where alaser dot generated by the laser pointer 114 appears on the target, theposition of the laser diode relative to the infrared array sensor shouldbe such that the laser dot would appear within a field-of-view of theinfrared array sensor.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, determining the one or morecoordinates of the scaled thermal output in relation to the one or morecoordinates of the scaled VLC output includes determining coordinates ofone or more corner points of the scaled thermal output. The one or morecoordinates can be used to determine where to display a field-of-viewindicator corresponding to the scaled thermal output. The processor 102can output the field-of-view indicator on the display 112 along with anoutput of the laser pointer 114 to allow a user to confirm that anoutput of the laser pointer 114 can be captured in a visible light imagewithin the field-of-view indicator. If the output of the laser pointer114 is not displayed within the field-of-view indicator, a manufacturerof the computing system 100 can modify the computing system 100 so thatthe output of the laser pointer 114 can be captured in a visible lightimage within the field-of-view indicator.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, a target of the scaled VLCoutput is a blackbody object.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, the output of the VLC and theoutput of the infrared array sensor are captured at a first operatingdistance. As an example, the first operating distance consists of a nearoperating distance. As another example, the first operating distanceconsists of a far operating distance. In at least some implementations,the near operating distance is a distance between 0.3 and 0.9 meters,and the far operating distance is a distance beyond 0.9 meters. Otherexamples of the near and/or far operating distances are possible.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, the alignment marker includesa cross-hair.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, the infrared array sensorincludes a thermopile array, a long wave infrared sensor array, a shortwave infrared sensor array, or a bolometer. The bolometer can, but neednot necessarily, be a microbolometer.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, the system further includes asubstrate and a component aligner. The component aligner is affixed tothe substrate. The infrared array sensor and the laser diode aredisposed within the component aligner. A component disposed within thecomponent aligner can be positioned within the component aligner beforeor after the component aligner is affixed to the substrate.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, capturing the output of theVLC and the output of the infrared array sensor includes capturing, withthe system located at a first distance from the target, a first outputof the VLC and a first output of the infrared array sensor,respectively. Moreover, the one or more coordinates of the output of theinfrared array sensor to calibrate the system are used for operationwhen the system is located at the first distance from a second target.In accordance with this implementation, the method includes capturing asecond output of the VLC and a second output of the infrared arraysensor using the system located at a second distance from the target.The method also includes scaling the second output of the VLC and thesecond output of the infrared array sensor to generate a second scaledVLC output and a second scaled thermal output. Additionally, the methodincludes aligning the second scaled VLC output to the second scaledthermal output to generate a second aligned image based on the secondscaled VLC output and the second scaled thermal output. The method alsoincludes determining, based on the second aligned image, one or morecoordinates of the second scaled thermal output in relation to one ormore coordinates of the second scaled VLC output. Also, the methodincludes outputting, by the laser diode, a second light beam to producea second laser dot on the target and then capturing a second furtheroutput of the VLC. The second further output of the VLC includes arepresentation of the second laser dot. Even more, the method includesdisplaying, on the display, the second further output of the VLC, andthe alignment marker. Furthermore, the method also includes shifting thealignment marker or the representation of the second laser dot so thatthe alignment marker and the representation of the second laser dot areshown at a second common position on the display. Furthermore still, themethod also includes determining one or more coordinates of the secondoutput of the infrared array sensor based on one or more coordinates ofthe second further output of the VLC where the alignment marker and therepresentation of the second laser dot are shown at the second commonposition on the display. Finally, the method also includes storing inthe memory the one or more coordinates of the second output of theinfrared array sensor to calibrate the system for operation when thesystem is located at the second distance from the second target. Inaccordance with this implementation, the first distance differs from thesecond distance.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, displaying the identifierincludes displaying an outline or matrix associated with the output ofthe infrared array sensor, the scaled thermal output, or both the outputof the infrared array sensor and the scaled thermal output.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, the method also includesreceiving directional input entered via a user control of the system. Inaccordance with this implementation, shifting the alignment marker orthe representation of the laser dot onto the other of the alignmentmarker and the representation of the laser dot is based on thedirectional input.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, the method also includesdetermining a position of the representation of the laser dot on thedisplay. In accordance with this implementation, shifting the alignmentmarker or the representation of the laser dot includes shifting thealignment marker so that the alignment marker is shown at the positionof the representation of the laser dot on the display. In at least someof these implementations, determining the position of the representationof the laser dot on the display occurs programmatically.

As an example, determining the position of the representation of thelaser dot on the display programmatically can include determining alarge contrast in pixel values representing the position of therepresentation of the laser dot with respect to pixel valuesrepresenting all other pixels of the display. In a particularimplementation, a white target can be disposed on the table 902 or thestand 908. The white target can, but need not necessarily, be metallic,plastic, or paper-based. The laser pointer 114 can generate a laser doton the white target. The processor 102 can detect the laser dot within avisible light image of the white target and the laser dot by detectingpixels that have certain levels of an RGB color space.

For at least some implementations, the RGB color space uses the values(0, 0) to represent the color black, and the values (255, 255, 255) torepresent the color white. The numbers within those parenthesesrepresent the following components of the RGB color space: (redcomponent, green component, and blue component).

As an example, the processor 102 can detect the pixels that have certainlevels of the example RGB color space using the following equations:

Color-component₁>Color-threshold₁   Equation 1:

Color-component₁−Color-component₂>Color-threshold₂; and   Equation 2:

Color-component₁−Color-component₃>Color-threshold₃.   Equation 3:

For an implementation in which the laser dot is red, theColor-component₁ is red, the Color-component₂ is green, and theColor-component₃ is blue. Moreover, the Color-threshold₁ is large enoughto be considered to include a sufficient level of the Color-component₁.As an example, the Color-threshold₁ can be a value of 80 as used withinthe example RGB color space. The Color-threshold₂ and theColor-threshold₃ can be an equivalent value, such as a value of 40 asused within the example RGB color space. One or more of theColor-threshold₁, Color-threshold₂ and Color-threshold₃ can be adjustedbased on ambient light conditions of an environment in which thedetection of the laser dot is performed.

With reference to FIG. 66, the representation of the laser dot 716 canrepresent a center of a red laser dot appearing on the white target suchthat at least the pixels 742, 743, 744, 745 have color components thatmeet Equation 1, Equation 2, and Equation 3 and exampleColor-threshold₁, Color-threshold₂, and Color-threshold₃ describedabove. As an example, the color components in the RGB space for thepixels 742, 743, 744, 745 can be (240, 20, 15), (243, 18, 16), (239, 19,17), (244, 20, 16), respectively. In this case, the processor 102 candetect a center pixel or pixels that represent a center of the red laserdot appearing on the white target and then determine an amount ofshifting left, right, up, and/or down required to shift the output ofthe VLC so that the laser dot in the output of the VLC is displayed atthe center of the display 112.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 590, the method also includesremovably affixing the system to an alignment fixture configured to holdthe system a particular distance from a target including a blackbody.

Next, FIG. 60 shows an alignment fixture 900 of an exampleimplementation that can, but need not necessarily, be used to perform atleast one function of the set 590. The alignment fixture 900 includes atable 902, a jig 904, a jig track 906, a stand 908, a stand 910, ablackbody calibrator 912 positioned on the stand 910, and a blackbodycalibrator 914 positioned on the stand 908. The blackbody calibrator912, 914 includes a blackbody source or a near ideal blackbody source.The blackbody source can include a target plate. The blackbodycalibrator 912, 914 can, but need not necessarily, include a targetplate window 916 that provides visual access to the target plate, adisplay 918, user controls 920, and/or a power cord 922. The usercontrols 920 for each blackbody calibrator 912, 914 can be used to setor modify a setpoint temperature desired for a target plate of eachblackbody calibrator 912, 914.

The jig 904 is configured to hold a computing system to be calibrated,such as the imaging system 10 and/or the computing system 100. The jigtrack 906 is configured to move the jig 904 and the computing system tobe calibrated in relation to the blackbody calibrator 912, 914. Adistance 924 between the blackbody calibrator 914 and the jig 904 is afirst calibration distance and a distance 926 between the blackbodycalibrator 912 and the jig 904 is a second calibration distance. In animplementation in which the alignment fixture 900 includes twoblackbodies, the distance 924 can be referred to as a near distance andthe distance 926 can be referred to as a far distance. In otherimplementations, the alignment fixture 900 includes a different numberof blackbodies. The jig track 906 can be configured to position thecomputing system to be calibrated to have a line-of-sight of eachblackbody of the alignment fixture 900.

Next, FIG. 67 shows a flowchart depicting a set of functions 750 (ormore simply “the set 750”) that can be carried out in accordance withthe example implementations described in this description. The set 750includes the functions shown in block 751 through block 754. Thefollowing description of the set 750 includes references to elementsshown in other figures described in this description, but the functionsof the set 750 are not limited to being carried out only by thereferenced elements. A variety of methods can be performed using all ofthe functions shown in the set 750 or any proper subset of the functionsshown in the set 750. Any of those methods can be performed with otherfunctions such as one or more of the other functions described in thisdescription. At least a portion of two or more functions of the set 750can occur simultaneously.

Block 751 includes capturing output of the VLC 108 and output of theinfrared array sensor 106 using a system including the VLC 108, theinfrared array sensor 106, the laser pointer 114, the memory 104, andthe display 112. The memory 104 includes a calibration based on aposition of the laser diode relative to the infrared array sensor. Inaccordance with the example implementations, the calibration stored inthe memory can include the coordinates of the output of the infraredarray sensor discussed above with respect to block 599.

In at least some implementations, the processor 102 scales the output ofthe VLC 108 to produce a scaled VLC output and scales the output of theinfrared array sensor to produce a scaled output of the infrared arraysensor 106. As described elsewhere in this description, scaling of theoutput of the VLC 108 can include bi-linear scaling and decimation, andscaling of the output of the infrared array sensor 106 can includebi-linear scaling.

In at least some implementations, the processor 102 shifts the scaledVLC output so that the scaled VLC output is aligned with the scaledoutput of the infrared array sensor 106. That shifting allows for thedisplay 112 to display a blended image where the target shown in thevisible light image is aligned with a representation of the target shownin the output of the infrared array sensor.

In at least some implementations, the processor 102 shifts the scaledVLC output based on a prior alignment of an output of the laser pointer114 and an alignment marker overlaid on the display 112 during analignment procedure of the imaging system 10 and/or the computing system100. The processor 102 can refer to values stored in the memory 104,where the values are indicative of how many pixels the scaled VLC outputshould be shifted in a positive or negative x-direction and/or apositive or negative y-direction. As indicated elsewhere in thisdescription, those values can be stored as uint 16 unsigned integers.

Next, block 752 includes outputting, by the laser pointer 114, a lightbeam to produce a laser dot on a target. The target can be any objectwhose temperature is to be measured. The laser dot can cover at least aportion of a surface area of the target. The laser dot on the targetcan, but need not necessarily, be circular. The output of the VLC 108includes a representation of the laser dot. In some implementations, therepresentation of the laser dot covers a square area including one ormore pixels. In at least some of those implementations, the laser dotcan, but need not necessarily, be two, three, four, five, six, seven oreight pixels wide. Other example widths of the laser dot represented inthe output of the VLC 108 are also possible.

In accordance with a particular example implementation in which theinfrared array sensor 106 includes a 32×32 sensor and the output of theinfrared array sensor 106 is up-scaled by five and a size of the laserdot in a displayed representation of the laser dot is 8×8 pixels. Insuch implementation, the laser dot is represented by 64 pixels from thescaled VLC output. Those 64 pixels correspond to 64 pixels of the scaledoutput of the infrared array sensor 106. Since the output of infraredarray sensor 106 is up-scaled by five, a single pixel of the infraredarray sensor 106 covers the laser dot best. The output of the infraredarray sensor 106 includes values indicative of infrared radiation fromthe target.

Next, block 753 includes determining a temperature based on a portion ofthe values indicative of infrared radiation from the target. The portionof the values includes values associated with a portion of the target atwhich the laser dot is produced. In accordance with at least someimplementations, determining the temperature includes determining anaverage value of the portion of the values indicative of infraredradiations from the target, such as infrared radiation from a surface ofthe target. As an example, the average value can include a mean value, amode value, or a median value.

In a particular implementation, the laser dot covers a square area thatpertains to a number of pixels in the infrared array sensor 106. As anexample, the laser dot covers five to six pixels from the up-scaledoutput of the infrared array sensor 106. Those five to six pixels couldpertain to a single thermal sensor of the infrared array sensor 106.Alternatively, those pixels could indicate the laser dot is between twosensors of the infrared array sensor 106. In order to improve theresults of determining the temperature, multiple pixels around a centerof the laser dot are sampled and used to determine an averagetemperature of those multiple pixels, or a subset of those multiplepixels, such as an average temperature based on the two pixels havingthe highest values. Temperature values based on other pixels of theinfrared array sensor 106 are discarded with respect to determining thetemperature.

Next, block 754 includes displaying, on the display 112, the output ofthe VLC 108 and the temperature. Displaying the output of the VLC 108includes displaying a visible light image showing the laser dot and atleast a portion of the target. In at least some implementations, theoutput of the VLC 108 includes a scaled output of the VLC, where thescaled output of the VLC includes an output scaled using bi-linearscaling and decimation and the scaled output of the VLC has been alignedwith a scaled output of the infrared array sensor 106 as describedelsewhere in this description even though the display 112 does notdisplay a blended image for block 754. In those or in otherimplementations, the output of the VLC 108 displayed on the display 112is shifted so that the laser dot is shown as being centered horizontallyand vertically in the display 112.

Turning to FIG. 63, a screen shot 720 of the display 112 in accordancewith the example implementations is shown. The screen shot 720 includesthe menus 706, 708, an image 722 output by the VLC 1018, and the laserdot 716. The laser dot 716 is shown on the screen shot 720 showing atarget 724. The target 724 can, but need not necessarily, be a vehicle,such as a motorcycle, or a non-vehicle target. The screen shot 720 alsoincludes a temperature 726, such as a determined temperature based on aportion of the values indicative of infrared radiation from the target724. The processor 102 can shift the output of the VLC 108 such that thelaser dot 716 is shown in a center of the display 112.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 750, the system also includes asubstrate 120 and a component aligner 122. The component aligner 122 isaffixed to the substrate 120. The infrared array sensor 106 and thelaser pointer 114 are disposed within the component aligner 122.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 750, each value of the portion ofvalues indicative of infrared radiation from the target is associatedwith a respective pixel of the output of the infrared array sensor.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 750, the method also includesstopping the outputting of the light beam, and displaying, on thedisplay when the light beam is not being output, a blended output basedon the output of the VLC and the output of the infrared array sensor.Displaying the blended output based on the output of the VLC and theoutput of the infrared array sensor includes producing a non-opaqueoutput in which the output of the VLC or the output of the infraredarray sensor is less than one hundred percent opaque.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 750, the method also includesdetermining a distance between the system and the target. Thecalibration is further based on distance between the system and thetarget. In accordance with at least some of those embodiments,determining the distance between the system and the target includesdetermining a user input indicative of the distance between the systemand the target. As an example, the user input can include a selection ofa near operating distance or a selection of a far operating distance.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 750, the calibration based on theposition of the laser diode relative to the infrared array sensor isindicative of one or more coordinates of the output of the infraredarray sensor determined by the an additional set of functions. Theadditional set of functions includes capturing output of the VLC andoutput of the infrared array sensor using the system. The additional setof functions includes scaling the output of the VLC and the output ofthe infrared array sensor to generate a scaled VLC output and a scaledthermal output. The additional set of functions also includes aligningthe scaled VLC output to the scaled thermal output to generate analigned image based on the scaled VLC output and the scaled thermaloutput. The additional set of functions includes determining, based onthe aligned image, one or more coordinates of the scaled thermal outputin relation to one or more coordinates of the scaled VLC output.Moreover, the additional set of functions includes outputting, by thelaser diode, a light beam to produce a laser dot on a target and thencapturing a further output of the VLC. The further output of the VLCincludes a representation of the laser dot. Furthermore, the additionalset of functions includes displaying, on the display, the further outputof the VLC, and an alignment marker. Furthermore still, the additionalset of functions includes shifting the alignment marker or therepresentation of the laser dot so that the alignment marker and therepresentation of the laser dot are shown at a common position on thedisplay. Finally, the additional set of functions includes determiningthe one or more coordinates of the output of the infrared array sensorbased on one or more coordinates of the further output of the VLC wherethe alignment marker and the representation of the laser dot are shownat the common position on the display.

In accordance with at least some of the aforementioned implementationsdescribed in connection with the set 750, the method also includesshifting the output of the VLC so that displaying the output of the VLCincludes displaying the representation of the laser dot in a center ofthe display 112. In at least some of those implementations, shifting theoutput of the VLC is based on a second calibration stored in the memory104. The second calibration indicates a quantity of pixels to move theoutput of the VLC horizontally and a quantity of pixels to move theoutput of the VLC vertically. The second calibration can be determinedby execution of program instructions that count the quantity of pixelsto move the output of the VLC horizontally and the quantity of pixels tomove the output of the VLC vertically such that a representation of thelaser dot and an alignment marker are shown at a common position on thedisplay. In accordance with example implementation shown in FIG. 66, thesecond calibration can be six pixels horizontally to the right and sixpixels vertically downward.

VI. EXAMPLE VEHICLE

In accordance with an example implementation, a component aligner can beincluded within a vehicle component (i.e., a component within avehicle). A vehicle component can include a computing system, such as anelectronic control unit (ECU) manufactured by and/or for an originalequipment manufacturer (OEM) of a vehicle. A vehicle component caninclude a sensor manufactured by or for an original equipmentmanufacturer (OEM) of a vehicle. In accordance with another exampleimplementation, a component aligner can be included with a vehicleservice tool (e.g., a vehicle scan tool or an imaging system).

A vehicle is a mobile machine that can be used to transport a person,people, and/or cargo. A vehicle can, but need not necessarily, be drivenand/or otherwise guided along a path (e.g., a paved road or otherwise)on land, in water, in the air, and/or outer space. A vehicle can, butneed not necessarily, be wheeled, tracked, railed, and/or skied. Avehicle can, but need not necessarily, include an automobile, amotorcycle, an all-terrain vehicle (ATV) defined by ANSI/SVIA-1-2007, asnowmobile, a personal watercraft (e.g., a JET SKI® personalwatercraft), a light-duty truck, a medium-duty truck, a heavy-dutytruck, a semi-tractor, a drone, and/or a farm machine. A vehicle can,but need not necessarily, include and/or use any appropriate voltageand/or current source, such as a battery, an alternator, a fuel cell,and the like, providing any appropriate current and/or voltage, such asabout 12 volts, about 42 volts, and the like. A vehicle can, but neednot necessarily, include and/or use any system and/or engine to provideits mobility. Those systems and/or engines can include vehiclecomponents that use fossil fuels, such as gasoline, natural gas,propane, and the like, electricity, such as that generated by a battery,magneto, fuel cell, solar cell and the like, wind and hybrids and/orcombinations thereof. A vehicle can, but need not necessarily, includean ECU, a data link connector (DLC), and a vehicle communication busthat connects the DLC to the ECU. A vehicle can be configured to operateas an autonomous vehicle.

Some vehicles can be identified by characteristics of the vehicle suchas characteristics indicative of when the vehicle was built (e.g., avehicle year), who built the vehicle (e.g., a vehicle make), marketingnames associated with vehicle (e.g., a vehicle model name, or moresimply “model”), and features of the vehicle (e.g., an engine type).This description uses an abbreviation YMME and/or Y/M/M/E, where eachletter in the order shown represents a model year, vehicle make, vehiclemodel name, and engine type, respectively. This description uses anabbreviation YMM and/or Y/M/M, where each letter in the order shownrepresents a model year, vehicle make, and vehicle model name,respectively. An example Y shown in the drawings is2019/Toyota/Camry/4Cyl, in which “2019” represents the model year thevehicle was built, “Toyota” represents the name of the vehiclemanufacturer Toyota Motor Corporation, Aichi Japan, “Camry” represents avehicle model built by that manufacturer, and “4Cyl” represents a anengine type (i.e., a four cylinder internal combustion engine) withinthe vehicle. A person skilled in the art will understand that otherfeatures in addition to or as an alternative to “engine type” can beused to identify a vehicle. These other features can be identified invarious manners, such as a regular production option (RPO) code, such asthe RPO codes defined by the General Motors Company LLC, Detroit Mich.In some example implementations, the tag array(s) associated with acontent file include one or more characteristic identifiers of avehicle.

Some vehicles, such as automobiles, are associated with a unique vehicleidentification number (VIN). Some VIN include seventeen alpha-numericcharacters. Some of the characters for at least some VIN represent aYMME or a YMM. In some instances, a vehicle includes a one dimensionalbar code indicative of a VIN associated with that vehicle. In someexample implementations, the tag array(s) associated with a content fileinclude one or more VIN characters and data representative of positionsof the VIN characters in a VIN.

A vehicle communication bus within a vehicle can include one or moreconductors (e.g., copper wire conductors) and/or can be wireless. As anexample, a vehicle communication bus can include one or two conductorsfor carrying vehicle data messages in accordance with a vehicle datamessage (VDM) protocol. A VDM protocol can include a Society ofAutomotive Engineers (SAE) J1850 (PWM or VPW) VDM protocol, anInternational Organization of Standardization (ISO) 15764-4 controllerarea network (CAN) VDM protocol, an ISO 9141-2 K-Line VDM protocol, anISO 14230-4 KWP2000 K-Line VDM protocol, or some other protocolpresently defined for performing communications within a vehicle.

The DLC can include an on-board diagnostic (OBD) connector, such as anOBD II connector. An OBD II connector can include slots for retaining upto sixteen connector terminals, but can include a different number ofslots or no slots at all. As an example, a DLC connector can include anOBD II connector that meets the SAE J1962 specification such as aconnector 16M, part number 12110252, available from Aptiv LLC of Dublin,Ireland. The DLC can include conductor terminals that connect to aconductor in a vehicle. For instance, the DLC can include connectorterminals that connect to conductors that respectively connect topositive and negative terminals of a vehicle battery. The DLC caninclude one or more conductor terminals that connect to a conductor ofthe vehicle communication bus such that the DLC is operatively connectedto the ECU. The data carried in a VDM can, but need not necessarily,include a parameter identifier (PID) and data (PID data) parametersassociated with the PID. The data carried in the VDM can, but need notnecessarily, include a diagnostic trouble code (DTC).

An ECU can control various aspects of vehicle operation and/orcomponents within a vehicle. For example, the ECU can include apowertrain (PT) system ECU, an engine control module (ECM) ECU, asupplemental inflatable restraint (SIR) system (i.e., an air bag system)ECU, an entertainment system ECU, or some other ECU. The ECU can receiveinputs (e.g., a sensor input), control output devices (e.g., asolenoid), generate a vehicle data message (VDM) (such as a VDM based ona received input or a controlled output), and set a DTC to a particularstate (such as active or history).

VII. CONCLUSION

It should be understood that the arrangements described herein and/orshown in the drawings are for purposes of example only and are notintended to be limiting. As such, those skilled in the art willappreciate that other arrangements and elements (e.g., machines,interfaces, functions, orders, and/or groupings of functions) can beused instead, and some elements can be omitted altogether. Furthermore,various functions described and/or shown in the drawings as beingperformed by one or more elements can be carried out by a processorexecuting computer-readable program instructions or by a combination ofhardware, firmware, and/or software. For purposes of this description,execution of CRPI contained in some computer-readable medium to performsome function can include executing all of the program instructions ofthose CRPI or only a portion of those CRPI.

While various aspects and implementations are described herein, otheraspects and implementations will be apparent to those skilled in theart. The various aspects and implementations disclosed herein are forpurposes of illustration and are not intended to be limiting, with thetrue scope being indicated by the claims, along with the full scope ofequivalents to which such claims are entitled. It is also to beunderstood that the terminology used herein for the purpose ofdescribing particular implementations only, and is not intended to belimiting.

In this description, the articles “a,” “an,” and “the” are used tointroduce elements and/or functions of the example implementations. Theintent of using those articles is that there is one or more of theintroduced elements and/or functions.

In this description, the intent of using the term “and/or” within a listof at least two elements or functions and the intent of using the terms“at least one of,” “at least one of the following,” “one or more of,”and “one or more of the following” immediately preceding a list of atleast two components or functions is to cover each implementationincluding a listed component or function independently and eachimplementation including a combination of the listed components orfunctions. For example, an implementation described as including A, B,and/or C, or at least one of A, B, and C, or at least one of: A, B, andC, or at least one of A, B, or C, or at least one of: A, B, or C, or oneor more of A, B, and C, or one or more of: A, B, and C, or one or moreof A, B, or C, or one or more of: A, B, or C is intended to cover eachof the following possible implementations: (i) an implementationincluding A, but not B and not C, (ii) an implementation including B,but not A and not C, (iii) an implementation including C, but not A andnot B, (iv) an implementation including A and B, but not C, (v) animplementation including A and C, but not B, (v) an implementationincluding B and C, but not A, and/or (vi) an implementation including A,B, and C. For the implementations including component or function A, theimplementations can include one A or multiple A. For the implementationsincluding component or function B, the implementations can include one Bor multiple B. For the implementations including component or functionC, the implementations can include one C or multiple C. The use ofordinal numbers such as “first,” “second,” “third” and so on is todistinguish respective elements rather than to denote a particular orderof those elements unless the context of using those terms explicitlyindicates otherwise. The use of the symbol “$” as prefix to a numberindicates the number is a hexadecimal number.

This application incorporates by reference U.S. patent application Ser.No. 16/459,233, which was filed on Jul. 1, 2019, and which is entitled“Apparatus with component aligner” and is associated with AttorneyDocket No. 19-185.

This application incorporates by reference U.S. patent application Ser.No. 16/459,315, which was filed on Jul. 1, 2019, and which is entitled“Apparatus with component aligner” and is associated with AttorneyDocket No. 19-1250.

This application incorporates by reference U.S. patent application Ser.No. 14/459,283, which was filed on Jul. 1, 2019, and which is entitled“Method and system for calibrating imaging system” and is associatedwith Attorney Docket No. 19-186.

Implementations of the present disclosure may thus relate to one of theenumerated example embodiments (EEEs) listed below.

EEE 1 is a method comprising: capturing output of a visible light camera(VLC) and output of an infrared array sensor using a system includingthe VLC, the infrared array sensor, a laser pointer, a memory, and adisplay. The method includes scaling the output of the VLC and theoutput of the infrared array sensor to generate a scaled VLC output anda scaled thermal output. The method also includes aligning the scaledVLC output to the scaled thermal output to generate an aligned imagebased on the scaled VLC output and the scaled thermal output. The methodalso includes determining one or more alignment values based on thealigned image. The method further includes outputting, by the laserpointer, a light beam to produce a laser dot on a target and thencapturing a further output of the VLC. The further output of the VLCincludes a representation of the laser dot. The method includesdisplaying, on the display, the further output of the VLC, and analignment marker. Furthermore, the method includes shifting thealignment marker or the representation of the laser dot so that thealignment marker and the representation of the laser dot are shown at acommon position on the display. Furthermore still, the method includesdetermining one or more coordinates of the output of the infrared arraysensor based on one or more coordinates of the further output of the VLCwhere the alignment marker and the representation of the laser dot areshown at the common position on the display. Finally, the methodincludes storing in the memory the one or more coordinates of the outputof the infrared array sensor to calibrate the system based on a positionof the laser pointer relative to the infrared array sensor.

EEE 2 is the method of EEE 1, wherein determining the one or morecoordinates of the scaled thermal output in relation to the one or morecoordinates of the scaled VLC output includes determining coordinates ofone or more corner points of the scaled thermal output.

EEE 3 is the method of EEE 1 or 2, wherein a target of the scaled VLCoutput is a blackbody object.

EEE 4 is the method of any one EEE 1 to 3, wherein the output of the VLCand the output of the infrared array sensor are captured at a firstoperating distance.

EEE 5 is the method of EEE 4, wherein the first operating distanceconsists of a near operating distance.

EEE 6 is the method of EEE 4, wherein the first operating distanceconsists of a far operating distance.

EEE 7 is the method of anyone of EEE 1 to 6, wherein the alignmentmarker includes a cross-hair.

EEE 8 is the method of any one of EEE 1 to 7, wherein the infrared arraysensor includes a thermopile array, a long wave infrared sensor array, ashort wave infrared sensor array, a bolometer, or a microbolometer.

EEE 9 is the method of any one of EEE 1 to 8, wherein the system furtherincludes a substrate and a component aligner. The component aligner isaffixed to the substrate. The infrared array sensor and the laserpointer are disposed within the component aligner.

EEE 10 is the method of any one of EEE 1 to 9, further comprising:displaying, on the display, an identifier corresponding to afield-of-view of the infrared array sensor for confirming therepresentation of the laser dot is shown with an area defined by theidentifier.

EEE 11 is the method of any one of EEE 1 to 10, wherein capturing theoutput of the VLC and the output of the infrared array sensor includescapturing, with the system located at a first distance from the target,a first output of the VLC and a first output of the infrared arraysensor, respectively. The one or more coordinates of the output of theinfrared array sensor to calibrate the system are used for operationwhen the system is located at the first distance from a second target.The method further includes: capturing a second output of the VLC and asecond output of the infrared array sensor using the system located at asecond distance from the target. The method further includes scaling thesecond output of the VLC and the second output of the infrared arraysensor to generate a second scaled VLC output and a second scaledthermal output. The method also includes aligning the second scaled VLCoutput to the second scaled thermal output to generate a second alignedimage based on the second scaled VLC output and the second scaledthermal output. The method further includes determining, based on thesecond aligned image, one or more coordinates of the second scaledthermal output in relation to one or more coordinates of the secondscaled VLC output. The method also includes outputting, by the laserpointer, a second light beam to produce a second laser dot on the targetand then capturing a second further output of the VLC. The secondfurther output of the VLC includes a representation of the second laserdot. The method also includes displaying, on the display, the secondfurther output of the VLC, and the alignment marker. The method alsoincludes shifting the alignment marker or the representation of thesecond laser dot so that the alignment marker and the representation ofthe second laser dot are shown at a second common position on thedisplay. Furthermore, the method includes determining one or morecoordinates of the second output of the infrared array sensor based onone or more coordinates of the second further output of the VLC wherethe alignment marker and the representation of the second laser dot areshown at the second common position on the display. Furthermore still,the method includes storing in the memory the one or more coordinates ofthe second output of the infrared array sensor to calibrate the systemfor operation when the system is located at the second distance from thesecond target. The first distance differs from the second distance.

EEE 12 is the method of EEE 11, further comprising: displaying, on thedisplay, an identifier corresponding to a field-of-view of the infraredarray sensor for confirming the representation of the second laser dotis shown with an area defined by the identifier.

EEE 13 is the method of EEE 12, wherein displaying the identifierincludes displaying an outline or matrix associated with the output ofthe infrared array sensor, the scaled thermal output, or both the outputof the infrared array sensor and the scaled thermal output.

EEE 14 is the method of any one of EEE 1 to 13, further comprisingreceiving directional input entered via a user control of the system.Shifting the alignment marker or the representation of the laser dotonto the other of the alignment marker and the representation of thelaser dot is based on the directional input.

EEE 15 is the method of any one of EEE 1 to 14, further comprisingdetermining a position of the representation of the laser dot on thedisplay. Shifting the alignment marker or the representation of thelaser dot includes shifting the alignment marker so that the alignmentmarker is shown at the position of the representation of the laser doton the display.

EEE 16 is the method of EEE 15, wherein determining the position of therepresentation of the laser dot on the display occurs programmatically.

EEE 17 is the method of EEE 16, wherein determining the position of therepresentation of the laser dot on the display programmatically includesdetermining a large contrast in pixel values representing the positionof the representation of the laser dot with respect to pixel valuesrepresenting all other pixels of the display.

EEE 18 is the method of EEE 16, wherein the pixels on the display have afirst color component of an red-green-blue (RGB) color space, a secondcolor component of the RGB color space, and a third color component ofthe RGB color space, wherein determining the position of therepresentation of the laser dot on the display programmatically includesdetermining which pixels on the display have (1) a value of the firstcolor component is above a first color threshold value, (2) the value ofthe first color component minus a value of the second color component isgreater than a second color threshold, and (3) the value of the firstcolor component minus a color value of the third color component isgreater than a third color threshold. Optionally, the second colorthreshold equals the third color threshold.

EEE 19 is the method of any one of EEE 1 to 18, further comprising:removably affixing the system to an alignment fixture configured to holdthe system a particular distance from a target including a blackbody.

EEE 20 is a computing system comprising one or more processorsconfigured to: capture output of a VLC and output of an infrared arraysensor using a system including the VLC, the infrared array sensor, alaser pointer, a memory, and a display. The one or more processors arealso configured to scale the output of the VLC and the output of theinfrared array sensor to generate a scaled VLC output and a scaledthermal output. The one or more processors are also configured to alignthe scaled VLC output to the scaled thermal output to generate analigned image based on the scaled VLC output and the scaled thermaloutput. The one or more processors are also configured to determine oneor more alignment values based on the aligned image. The one or moreprocessors are also configured to output, by the laser pointer, a lightbeam to produce a laser dot on a target and then capturing a furtheroutput of the VLC. The further output of the VLC includes arepresentation of the laser dot. The one or more processors are alsoconfigured to display, on the display, the further output of the VLC,and an alignment marker. The one or more processors are also configuredto shift the alignment marker or the representation of the laser dot sothat the alignment marker and the representation of the laser dot areshown at a common position on the display. The one or more processorsare also configured to determine one or more coordinates of the outputof the infrared array sensor based on one or more coordinates of thefurther output of the VLC where the alignment marker and therepresentation of the laser dot are shown at the common position on thedisplay. The one or more processors are also configured to store in thememory the one or more coordinates of the output of the infrared arraysensor to calibrate the system based on a position of the laser pointerrelative to the infrared array sensor.

EEE 21 is a computing system configured to perform the method of any oneof EEE 1 to 19.

EEE 22 is a non-transitory computer readable medium having storedtherein instructions executable by one or more processors to cause acomputing system to perform functions comprising capturing output of avisible light camera (VLC) and output of an infrared array sensor usinga system including the VLC, the infrared array sensor, a laser pointer,a memory, and a display. The functions further comprise scaling theoutput of the VLC and the output of the infrared array sensor togenerate a scaled VLC output and a scaled thermal output. The functionsfurther comprise aligning the scaled VLC output to the scaled thermaloutput to generate an aligned image based on the scaled VLC output andthe scaled thermal output. The functions further comprise determiningone or more alignment values based on the aligned image. The functionsfurther comprise outputting, by the laser pointer, a light beam toproduce a laser dot on a target and then capturing a further output ofthe VLC. The further output of the VLC includes a representation of thelaser dot. The functions further comprise displaying, on the display,the further output of the VLC, and an alignment marker. The functionsfurther comprise shifting the alignment marker or the representation ofthe laser dot so that the alignment marker and the representation of thelaser dot are shown at a common position on the display. The functionsfurther comprise determining one or more coordinates of the output ofthe infrared array sensor based on one or more coordinates of thefurther output of the VLC where the alignment marker and therepresentation of the laser dot are shown at the common position on thedisplay. The functions further comprise storing in the memory the one ormore coordinates of the output of the infrared array sensor to calibratethe system based on a position of the laser pointer relative to theinfrared array sensor.

EEE 23 is a non-transitory computer readable medium having storedtherein instructions executable by one or more processors to cause acomputing system to perform the method of any one of EEE 1 to 19.

EEE 24 is a method comprising: capturing output of a visible lightcamera (VLC) and output of an infrared array sensor using a systemincluding the VLC, the infrared array sensor, a laser pointer, a memory,and a display. The memory includes a calibration based on a position ofthe laser pointer relative to the infrared array sensor. The methodincludes outputting, by the laser pointer, a light beam to produce alaser dot on a target, wherein the output of the VLC includes arepresentation of the laser dot. The output of the infrared array sensorincludes values indicative of infrared radiation from the target. Themethod also includes determining a temperature based on a portion of thevalues indicative of infrared radiation from the target. The portion ofthe values includes values associated with a portion of the target atwhich the laser dot is produced. The method also includes displaying, onthe display, the output of the VLC and the temperature, whereindisplaying the output of the VLC includes displaying a visible lightimage showing the laser dot and at least a portion of the target.

EEE 25 is the method of EEE 24, wherein each value of the portion of thevalues indicative of infrared radiation from the target is associatedwith a respective pixel of the output of the infrared array sensor.

EEE 26 is the method of EEE 24 or 25, wherein determining thetemperature includes determining an average value of the portion of thevalues indicative of infrared radiation from the target.

EEE 27 is the method of any one of EEE 24 to 26, wherein determining thetemperature includes sampling four pixels around a center of therepresentation of the laser dot and determining an average value of twoof the four pixels.

EEE 28 is the method of EEE 27, wherein the two of the four pixels havevalues greater than two other pixels of the four pixels.

EEE 29 is the method of any one of EEE 24 to 28, wherein the systemfurther includes a substrate and a component aligner. The componentaligner is affixed to the substrate. The infrared array sensor and thelaser pointer are disposed within the component aligner.

EEE 30 is the method of any one of EEE 24 to 29, further comprising:stopping the outputting of the light beam, and displaying, on thedisplay when the light beam is not being output, a blended output basedon the output of the VLC and the output of the infrared array sensor.Displaying the blended output based on the output of the VLC and theoutput of the infrared array sensor includes producing a non-opaqueoutput in which the output of the VLC or the output of the infraredarray sensor is less than one hundred percent opaque.

EEE 31 is the method of any one of EEE 24 to 30, further comprisingdetermining a distance between the system and the target. Thecalibration is further based on distance between the system and thetarget.

EEE 32 is the method of EEE 24, wherein determining the distance betweenthe system and the target includes determining a user input indicativeof the distance between the system and the target.

EEE 33 is the method of EEE 32, wherein the user input includes aselection of a near operating distance or a selection of a far operatingdistance.

EEE 34 is the method of any one of EEE 24 to 33, wherein the calibrationbased on the position of the laser pointer relative to the infraredarray sensor is indicative of one or more coordinates of the output ofthe infrared array sensor.

EEE 35 is the method of EEE 34 wherein the one or more coordinates ofthe output of the infrared array sensor are determined by: (i) capturingoutput of the VLC and output of the infrared array sensor using thesystem; scaling the output of the VLC and the output of the infraredarray sensor to generate a scaled VLC output and a scaled thermaloutput; aligning the scaled VLC output to the scaled thermal output togenerate an aligned image based on the scaled VLC output and the scaledthermal output, (ii) determining, based on the aligned image, one ormore coordinates of the scaled thermal output in relation to one or morecoordinates of the scaled VLC output, (iii) outputting, by the laserpointer, a light beam to produce a laser dot on a target and thencapturing a further output of the VLC, wherein the further output of theVLC includes a representation of the laser dot, (iv) displaying, on thedisplay, the further output of the VLC, and an alignment marker, (v)shifting the alignment marker or the representation of the laser dot sothat the alignment marker and the representation of the laser dot areshown at a common position on the display, and (vi) determining the oneor more coordinates of the output of the infrared array sensor based onone or more coordinates of the further output of the VLC where thealignment marker and the representation of the laser dot are shown atthe common position on the display.

EEE 36 is the method of EEE 35, wherein scaling the output of the VLCincludes bi-linear scaling and decimation and scaling the output of theinfrared array sensor include bi-linear scaling.

EEE 37 is the method of EEE 35, wherein capturing the output of theinfrared array sensor includes capturing infrared radiation emitted by ablackbody calibration unit.

EEE 38 is the method of EEE 34, wherein the one or more coordinates ofthe output of the infrared array sensor include a row coordinate of theinfrared array sensor and a column coordinate of the infrared arraysensor.

EEE 39 is the method EEE 34 wherein the one or more coordinates of theoutput of the infrared array sensor include a sensor number assigned toa sensor of the infrared array sensor.

EEE 40 is the method of any one of EEE 24 to 39, further comprising:shifting the output of the VLC so that displaying the output of the VLCincludes displaying the representation of the laser dot in a center ofthe display.

EEE 41 is the method of EEE 40, wherein shifting the output of the VLCis based on a second calibration stored in the memory. The secondcalibration indicates a quantity of pixels to move the output of the VLChorizontally and a quantity of pixels to move the output of the VLCvertically. The second calibration is determined by execution of programinstructions that count the quantity of pixels to move the output of theVLC horizontally and the quantity of pixels to move the output of theVLC vertically such that a representation of the laser dot and analignment marker are shown at a common position on the display.

EEE 42 is a computing system comprising: one or more processorsconfigured to capture output of a VLC and output of an infrared arraysensor using a system including the VLC, the infrared array sensor, alaser pointer, a memory, and a display. The memory includes acalibration based on a position of the laser pointer relative to theinfrared array sensor. The one or more processors are also configured tooutput, by the laser pointer, a light beam to produce a laser dot on atarget. The output of the VLC includes a representation of the laserdot. The output of the infrared array sensor includes values indicativeof infrared radiation from the target. The one or more processors arealso configured to determine a temperature based on a portion of thevalues indicative of infrared radiation from the target. The portion ofthe values includes values associated with a portion of the target atwhich the laser dot is produced. The one or more processors are alsoconfigured to display, on the display, the output of the VLC and thetemperature. Displaying the output of the VLC includes displaying avisible light image showing the laser dot and at least a portion of thetarget.

EEE 43 is a computing system configured to perform the method of any oneof EEE 24 to 41.

EEE 44 is a non-transitory computer readable medium having storedtherein instructions executable by one or more processors to cause acomputing system to perform a set of functions. The set of functionsincludes capturing output of a visible light camera (VLC) and output ofan infrared array sensor using a system including the VLC, the infraredarray sensor, a laser pointer, a memory, and a display. The memoryincludes a calibration based on a position of the laser pointer relativeto the infrared array sensor. The set of functions includes outputting,by the laser pointer, a light beam to produce a laser dot on a target,wherein the output of the VLC includes a representation of the laserdot. The output of the infrared array sensor includes values indicativeof infrared radiation from the target. The set of functions includesdetermining a temperature based on a portion of the values indicative ofinfrared radiation from the target. The portion of the values includesvalues associated with a portion of the target at which the laser dot isproduced. The set of functions also includes displaying, on the display,the output of the VLC and the temperature. Displaying the output of theVLC includes displaying a visible light image showing the laser dot andat least a portion of the target.

EEE 45 is a non-transitory computer readable medium having storedtherein instructions executable by one or more processors to cause acomputing system to perform the method of any one of EEE 24 to 41.

What is claimed is:
 1. A method comprising: capturing output of avisible light camera (VLC) and output of an infrared array sensor usinga system including the VLC, the infrared array sensor, a laser pointer,a memory, and a display, wherein the memory includes a calibration basedon a position of the laser pointer relative to the infrared arraysensor; outputting, by the laser pointer, a light beam to produce alaser dot on a target, wherein the output of the VLC includes arepresentation of the laser dot, and wherein the output of the infraredarray sensor includes values indicative of infrared radiation from thetarget; determining a temperature based on a portion of the valuesindicative of infrared radiation from the target, wherein the portion ofthe values includes values associated with a portion of the target atwhich the laser dot is produced; and displaying, on the display, theoutput of the VLC and the temperature, wherein displaying the output ofthe VLC includes displaying a visible light image showing the laser dotand at least a portion of the target.
 2. The method of claim 1, whereineach value of the portion of the values indicative of infrared radiationfrom the target is associated with a respective pixel of the output ofthe infrared array sensor.
 3. The method of claim 1, wherein determiningthe temperature includes determining an average value of the portion ofthe values indicative of infrared radiation from the target.
 4. Themethod of claim 1, wherein determining the temperature includes samplingfour pixels around a center of the representation of the laser dot anddetermining an average value of two of the four pixels.
 5. The method ofclaim 4, wherein the two of the four pixels have values greater than twoother pixels of the four pixels.
 6. The method of claim 1, wherein thesystem further includes a substrate and a component aligner, wherein thecomponent aligner is affixed to the substrate, and wherein the infraredarray sensor and the laser pointer are disposed within the componentaligner.
 7. The method of claim 1, further comprising: stopping theoutputting of the light beam; and displaying, on the display when thelight beam is not being output, a blended output based on the output ofthe VLC and the output of the infrared array sensor, wherein displayingthe blended output based on the output of the VLC and the output of theinfrared array sensor includes producing a non-opaque output in whichthe output of the VLC or the output of the infrared array sensor is lessthan one hundred percent opaque.
 8. The method of claim 1, furthercomprising: determining a distance between the system and the target,wherein the calibration is further based on distance between the systemand the target.
 9. The method of claim 8, wherein determining thedistance between the system and the target includes determining a userinput indicative of the distance between the system and the target. 10.The method of claim 9, wherein the user input includes a selection of anear operating distance or a selection of a far operating distance. 11.The method of claim 1, wherein the calibration based on the position ofthe laser pointer relative to the infrared array sensor is indicative ofone or more coordinates of the output of the infrared array sensor. 12.The method of claim 11, wherein the one or more coordinates of theoutput of the infrared array sensor are determined by: capturing outputof the VLC and output of the infrared array sensor using the system;scaling the output of the VLC and the output of the infrared arraysensor to generate a scaled VLC output and a scaled thermal output;aligning the scaled VLC output to the scaled thermal output to generatean aligned image based on the scaled VLC output and the scaled thermaloutput; determining, based on the aligned image, one or more coordinatesof the scaled thermal output in relation to one or more coordinates ofthe scaled VLC output; outputting, by the laser pointer, a light beam toproduce a laser dot on a target and then capturing a further output ofthe VLC, wherein the further output of the VLC includes a representationof the laser dot; displaying, on the display, the further output of theVLC, and an alignment marker; shifting the alignment marker or therepresentation of the laser dot so that the alignment marker and therepresentation of the laser dot are shown at a common position on thedisplay; and determining the one or more coordinates of the output ofthe infrared array sensor based on one or more coordinates of thefurther output of the VLC where the alignment marker and therepresentation of the laser dot are shown at the common position on thedisplay.
 13. The method of claim 12, wherein scaling the output of theVLC includes bi-linear scaling and decimation and scaling the output ofthe infrared array sensor include bi-linear scaling.
 14. The method ofclaim 12, wherein capturing the output of the infrared array sensorincludes capturing infrared radiation emitted by a blackbody calibrationunit.
 15. The method of claim 11, wherein the one or more coordinates ofthe output of the infrared array sensor include a row coordinate of theinfrared array sensor and a column coordinate of the infrared arraysensor.
 16. The method of claim 11, wherein the one or more coordinatesof the output of the infrared array sensor include a sensor numberassigned to a sensor of the infrared array sensor.
 17. The method ofclaim 1, further comprising: shifting the output of the VLC so thatdisplaying the output of the VLC includes displaying the representationof the laser dot in a center of the display.
 18. The method of claim 17,wherein shifting the output of the VLC is based on a second calibrationstored in the memory, wherein the second calibration indicates aquantity of pixels to move the output of the VLC horizontally and aquantity of pixels to move the output of the VLC vertically, and whereinthe second calibration is determined by execution of programinstructions that count the quantity of pixels to move the output of theVLC horizontally and the quantity of pixels to move the output of theVLC vertically such that a representation of the laser dot and analignment marker are shown at a common position on the display.
 19. Acomputing system comprising: one or more processors configured to:capture output of a visible light camera (VLC) and output of an infraredarray sensor using a system including the VLC, the infrared arraysensor, a laser pointer, a memory, and a display, wherein the memoryincludes a calibration based on a position of the laser pointer relativeto the infrared array sensor; output, by the laser pointer, a light beamto produce a laser dot on a target, wherein the output of the VLCincludes a representation of the laser dot, and wherein the output ofthe infrared array sensor include values indicative of infraredradiation from the target; determine a temperature based on a portion ofthe values indicative of infrared radiation from the target, wherein theportion of the values includes values associated with a portion of thetarget at which the laser dot is produced; and display, on the display,the output of the VLC and the temperature, wherein displaying the outputof the VLC includes displaying a visible light image showing the laserdot and at least a portion of the target.
 20. A non-transitory computerreadable medium having stored therein instructions executable by one ormore processors to cause a computing system to perform a set offunctions comprising: capturing output of a visible light camera (VLC)and output of an infrared array sensor using a system including the VLC,the infrared array sensor, a laser pointer, a memory, and a display,wherein the memory includes a calibration based on a position of thelaser pointer relative to the infrared array sensor; outputting, by thelaser pointer, a light beam to produce a laser dot on a target, whereinthe output of the VLC includes a representation of the laser dot, andwherein the output of the infrared array sensor includes valuesindicative of infrared radiation from the target; determining atemperature based on a portion of the values indicative of infraredradiation from the target, wherein the portion of the values includesvalues associated with a portion of the target at which the laser dot isproduced; and displaying, on the display, the output of the VLC and thetemperature, wherein displaying the output of the VLC includesdisplaying a visible light image showing the laser dot and at least aportion of the target.